The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Jul. 24, 2007
Mon-chin Tsai, Chu-Tong, TW;
Hsiu-mei Yo, Hsin-Chu, TW;
Chien-min Lin, Taipei, TW;
Chia-jen Cheng, Banciao, TW;
Li-hsin Tseng, Jhubei, TW;
Mon-Chin Tsai, Chu-Tong, TW;
Hsiu-Mei Yo, Hsin-Chu, TW;
Chien-Min Lin, Taipei, TW;
Chia-Jen Cheng, Banciao, TW;
Li-Hsin Tseng, Jhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.