Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Feng Chen

Hao-Yi Tsai

Chen-Hua Douglas Yu

Chih-Hua Chen

Chung-Shi Liu

Chen-Shien Chen

Han-Ping Pu

Yu-Chih Huang

Tin-Hao Kuo

Chun-Hung Lin

Yu-Jen Cheng

Mirng-Ji Lii

Kai-Chiang Wu

Sheng-Yu Wu

Yen-Liang Lin

Ming-Da Cheng

Hung-Jui Kuo

Chih-Wei Lin

Ming-Che Ho

Kuo Lung Pan

Yu-min Liang

Hsien-Wei Chen

Chun-Lin Lu

Chih-Hsuan Tai

Tsung-Ding Wang

Yu-Chen Hsu

Yuh Chern Shieh

Hui-Jung Tsai

Chun-Cheng Lin

Chita Chuang

Wei Sen Chang

Cheng Jen Lin

Ying-Ju Chen

Tsung-Yuan Yu

Tsung-Shu Lin

Meng-Tse Chen

Yi-Wen Wu

Chih-Hang Tung

Ming Hung Tseng

Kuei-Wei Huang

Ming-Kai Liu

Jung Wei Cheng

Sen-Kuei Hsu

Yu-Wei Lin

Hao-Cheng Hou

Guan-Yu Chen

Hsien-Liang Meng

Pei-Chun Tsai

De-Yuan Lu

Chin Wei Kang

Yung-Ching Chao

Chun Kai Tzeng

Chun-Lei Hsu

Jiun Yi Wu

Hung-Yi Kuo

Wen-Hsiung Lu

Shih-Wei Liang

Kuo-Ching Hsu

Hsien-Ming Tu

Chang-Pin Huang

Kuo-Lung Pan

Ying-Jui Huang

Hong-Seng Shue

Yu-Ling Tsai

Wei-Sen Chang

Chao-Yi Wang

Ming-Hong Cha

Yu Yi Huang

Hung-Jui Kou

Chih-Hsiang Tseng

A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Fingerprint sensor device and method

A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Fingerprint sensor in InFO structure and formation method

A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Metal bumps and method forming same

Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.

Package structure and method of forming the same

Package structures and method of forming the same

Fingerprint sensor in info structure and formation method

Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.

Wireless charging devices having wireless charging coils and methods of manufacture thereof

A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.

A device is provided. The device includes a bridge layer over a first substrate. A first connector electrically connecting the bridge layer to the first substrate. A first die is coupled to the bridge layer and the first substrate, and a second die is coupled to the bridge layer.

Multi-die package with bridge layer

A semiconductor device includes a first semiconductor die package. The first semiconductor package includes a molding compound, and a conductive element in the molding compound, wherein a top surface of the conductive element is above or co-planar with a top-most surface of the molding compound. The semiconductor device further includes a second semiconductor die package. The second semiconductor package includes a plurality of copper-containing contacts on a single metal pad, wherein each of the plurality of copper-containing contacts is bonded to the conductive element.

Semiconductor device package including embedded conductive elements

A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.

Semiconductor package and manufacturing process thereof

A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.

Semiconductor device and method of forming same

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Hsin-Chu, Taiwan

Yu-Feng Chen