Taiwan Semiconductor Manufacturing Comp. Ltd.

Industrial Technology Research Institute

Chih-Hua Chen

Hao-Yi Tsai

Chen-Shien Chen

Yu-Feng Chen

Chen-Hua Douglas Yu

Yu-Chih Huang

Chung-Shi Liu

Chen-Cheng Kuo

Ching-Wen Hsiao

Chih-Hsuan Tai

Chih-Wei Lin

Ting-Ting Kuo

Yu-Jen Cheng

Tin-Hao Kuo

Ming-Da Cheng

Hsin-Yu Pan

Kai-Ming Ching

Shih-Wei Chen

Chia-Hung Liu

Lipu Kris Chuang

Hsiu-Jen Lin

Ching-Hua Hsieh

Tzuan-Horng Liu

Ying-Cheng Tseng

Ming Hung Tseng

Chita Chuang

Wen-Wei Shen

Hung-Jui Kuo

Hui-Jung Tsai

En-Hsiang Yeh

Monsen Liu

Hsu-Hsien Chen

Chen Chen-Shien

Shin-Puu Jeng

Shang-Yun Hou

Wei-Yu Chen

Wei-Cheng Wu

Yao-Chun Chuang

Yu-Peng Tsai

Chih-Chiang Tsao

Chia-Shen Cheng

Chien-Fa Lee

Hao-Juin Liu

Ming-Han Liao

Cho-Fan Hsieh

Feng-Kuang Wu

Jen-Jui Yu

Hsiu-Ping Wei

Chi-Wei Chen

Fu-Cheng Hung

Ming-Fa Chen

Kuo-Chung Yee

Hung-Yi Kuo

Yen-Liang Lin

Shih-Wei Liang

Hsien-Ming Tu

Chang-Pin Huang

Ming-Hung Tseng

Yen-Chang Hu

Han-Hsiang Huang

Teng-Chun Wu

Shou-Cheng Hu

Chun-Ti Lu

Hung-Sen Wu

Kuo-Ching “Steven” Hsu

A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Package structure

A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Fingerprint sensor device and method

A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Fingerprint sensor in InFO structure and formation method

Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A first top package and a second top package are disposed on a surface of the redistribution structure further away from the die. An underfill is formed into the space between the first and second top packages and between the first and second top packages and the bottom package. The underfill covers at least a side surface of the first top package and a side surface of the second top package. A hole is opened in the underfill within an area overlapping with the die between the side surface of the first top package and the side surface of the second top package. A thermally conductive block is formed in the hole by filling the hole with a thermally conductive material.

Semiconductor package with thermal relaxation block and manufacturing method thereof

A package structure and a method of manufacturing the same are provided. The package structure includes a die, an encapsulant, a first redistribution line (RDL) structure, a second RDL structure, a conductive terminal, and a through via. The encapsulant laterally encapsulates the die. The first redistribution line (RDL) structure on a first side of the die and the encapsulant, wherein the first RDL structure comprises a dielectric layer and a redistribution layer in the dielectric layer. The second RDL structure is located on a second side of the die and the encapsulant. The conductive terminal is connected to the redistribution layer. The through via extends through the encapsulant and the redistribution layer to contact the conductive terminal and the second RDL structure.

Package structure with through via extending through redistribution layer and method of manufacturing the same

Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.

Package structure and method of forming the same

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

Robot gripper for moving wafer carriers and packing materials and method of operating the same

Package structure with through-via in molding compound and dielectric layer

A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.

Package structures and methods for forming the same

Package structures and method of forming the same

A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Manufacturing method of fingerprint sensor

A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

Package structure and manufacturing method thereof

A semiconductor package includes a redistribution structure, at least one semiconductor device, a heat dissipation component, and an encapsulating material. The at least one semiconductor device is disposed on and electrically connected to the redistribution structure. The heat dissipation component is disposed on the redistribution structure and includes a concave portion for receiving the at least one semiconductor device and an extending portion connected to the concave portion and contacting the redistribution structure, wherein the concave portion contacts the at least one semiconductor device. The encapsulating material is disposed over the redistribution structure, wherein the encapsulating material fills the concave portion and encapsulates the at least one semiconductor device.

Semiconductor package and method of manufacturing the same

Fingerprint sensor in info structure and formation method

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Zhubei, Taiwan

Chih-Hua Chen