The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

May. 12, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chien-Fa Lee, Hsinchu, TW;

Feng-Kuang Wu, Hsinchu County, TW;

Fu-Cheng Hung, Tainan, TW;

Chi-Wei Chen, Hsinchu, TW;

Chih-Hua Chen, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B25J 11/00 (2006.01); B25J 15/00 (2006.01); B65B 69/00 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
B25J 11/0095 (2013.01); B25J 15/0014 (2013.01); B25J 15/0028 (2013.01); B25J 15/0052 (2013.01); B65B 69/00 (2013.01); H01L 21/67379 (2013.01);
Abstract

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.


Find Patent Forward Citations

Loading…