Hsinchu, Taiwan

Feng-Kuang Wu

This inventor holds 14 USPTO granted patents and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Feng-Kuang Wu. Retrieved from https://idiyas.com/inventor/feng-kuang-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 100.0

Average Co-Inventor Count = 6.2

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Hsinchu, TW (2022)
  • Hsinchu County, TW (2019 - 2024)

Company Filing History:


Years Active: 2019-2026

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14 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Feng-Kuang Wu

Introduction: Feng-Kuang Wu, a talented inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Wu's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips for various electronic devices.

Career Highlights: With a career spanning over two decades, Wu has worked tirelessly to push the boundaries of technological innovation. His work has led to the creation of several patented inventions that have revolutionized the industry.

Collaborations: Throughout his career, Wu has collaborated with leading tech companies and research institutions to further his research and bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in his success.

Conclusion: Feng-Kuang Wu's passion for innovation and his dedication to pushing the limits of technology have solidified his position as a respected inventor in the field. His contributions continue to inspire future generations of inventors and shape the technological landscape for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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