The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Aug. 25, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Chien-Fa Lee, Hsinchu, TW;
Feng-Kuang Wu, Hsinchu County, TW;
Fu-Cheng Hung, Tainan, TW;
Chi-Wei Chen, Hsinchu, TW;
Chih-Hua Chen, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B25J 11/00 (2006.01); B65B 69/00 (2006.01); H01L 21/673 (2006.01); B25J 15/00 (2006.01);
U.S. Cl.
CPC ...
B25J 11/0095 (2013.01); B25J 15/0014 (2013.01); B25J 15/0028 (2013.01); B25J 15/0052 (2013.01); B65B 69/00 (2013.01); H01L 21/67379 (2013.01);
Abstract
A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable support pin at a bottom of the clamp assembly.