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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12165906 B1

PDFFull Text
Date of Patent:
Dec. 10, 2024

Filed:

Oct. 10, 2019

Apparatus and methods for handling semiconductor part carriers

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Ren-Hau Wu, Hsin-Chu, TW;

Yan-Han Chen, Hsin-Chu, TW;

Cheng-Kang Hu, Kaohsiung, TW;

Feng-Kuang Wu, Hsin-Chu, TW;

Hsu-Shui Liu, Pingjhen, TW;

Jiun-Rong Pai, Jhubei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Attorney:

Duane Morris LLP

Primary Examiner:

Gerald McClain

Int. Cl.
CPC ...
H01L 21/687 (2006.01); B25J 9/16 (2006.01); B65G 47/90 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H04N 23/56 (2023.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); B25J 9/1697 (2013.01); B65G 47/905 (2013.01); H01L 21/67259 (2013.01); H04N 23/56 (2023.01);
Abstract

An apparatus for handling semiconductor part carriers includes: a mechanical arm and an imaging system coupled to the mechanical arm, wherein the mechanical arm is configured for holding a semiconductor part carrier, and the imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

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Quick Actions:

Wu, Ren-Hau. (2024). Apparatus and methods for handling semiconductor part carriers (U.S. Patent No. 12165906). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12165906

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