Taiwan Semiconductor Manufacturing Comp. Ltd.

Feng-Kuang Wu

Hsu-Shui Liu

Jiun-Rong Pai

Shou-Wen Kuo

Sing-Tsung Li

Cheng-Kang Hu

Chih-Kuo Chang

Yan-Han Chen

Cheng-Hung Chen

Ren-Hau Wu

Chih-Hua Chen

Chien-Fa Lee

Chao-Keng Li

Wun-Kai Tsai

Zheng-Jie Xu

Wen-Che Liang

Chi-Wei Chen

Fu-Cheng Hung

Yang-Ann Chu

Cheng-Lung Wu

An apparatus for handling semiconductor part carriers includes: a mechanical arm and an imaging system coupled to the mechanical arm, wherein the mechanical arm is configured for holding a semiconductor part carrier, and the imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

Apparatus and methods for handling semiconductor part carriers

In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

Systems and methods for raised floor automated sensor vehicles

A fabrication system for fabricating IC is provided. A processing tool includes at least one electrode and a RF sensor. The electrode is configured to receive a radio frequency (RF) signal from an RF signal generator during first and second semiconductor manufacturing processes. The RF sensor wirelessly detects intensity of the RF signal. A computation device extracts statistical characteristics with a sampling rate based on the detected intensity of the RF signal. A fault detection and classification (FDC) system includes a processor. The processor is configured to determine whether or not the detected intensity of the RF signal exceeds a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the processor notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

Arcing protection method, processing tool and fabrication system

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

Robot gripper for moving wafer carriers and packing materials and method of operating the same

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable support pin at a bottom of the clamp assembly.

A fabrication system for fabricating an IC is provided which includes a processing tool, a computation device and a FDC system. The processing tool includes an electrode and an RF sensor to execute a semiconductor manufacturing process to fabricate the IC. The RF sensor wirelessly detects the intensity of the RF signal. The computation device extracts statistical characteristics based on the detection of the intensity of the RF signal. The FDC system determines whether or not the intensity of the RF signal meets a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the FDC system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

Arcing protection method and processing tool

An under-floor charging station can be mounted under a floor such that a top plate of the under-floor charging station is substantially flush with a top surface of the floor without touching the ground. Openings in the top plate allow charging elements to extend when in use to charge a mobile robot, and to retract under the floor when not in use. The retractable charging elements prevent tripping hazards and allow the mobile robot to move freely throughout a clean room. Moreover, because the charging elements can be retracted in an unobtrusive position when the under-floor charging station is not in use, the under-floor charging station is permitted to be positioned in locations in the clean room that allow the mobile robot to continue working while charging and/or allow non-stop running of the mobile robot.

Under-floor charging station

A method for positioning a mobile device relative to a stationary device in a semiconductor manufacturing environment is disclosed. The method includes detecting a target affixed to the stationary device at a target location, wherein the target location corresponds to a location of the target relative to a reference point on the stationary device, determining a first position coordinate offset value based upon detecting the target, and moving the mobile device, using the first position coordinate offset value, relative to train the mobile device to move relative to the stationary device for the stationary device to performing a semiconductor manufacturing operation.

Device positioning using sensors

Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

Growing community of inventors

Hsinchu County, Taiwan

Feng-Kuang Wu