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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yu-Chih Huang

This inventor holds 79 USPTO granted patents and 16 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Industrial Technology Research Institute, Chunghwa Picture Tubes, Ltd.. Active years: 2003-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Chih Huang. Retrieved from https://idiyas.com/inventor/yu-chih-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 79 

% Patents Active = 94.9

Average Co-Inventor Count = 6.2

ph-index = 6

Forward Citations = 181(Granted Patents)

Forward Citations (Not Self Cited) = 147(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Taichung, TW (2003)
  • Taipei, TW (2020)
  • Hsin-Chu, TW (2004 - 2024)

Company Filing History:

goldMedal76 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 9,303 
 
Industrial Technology Research Institute
 patents
bronzeMedal1 out of 980 
 
Chunghwa Picture Tubes, Ltd.
 patents
4. 1 out of 1,244 
 
National Yang Ming Chiao Tung University
 patents
where one patent can have more than one assignee

Years Active: 2003-2026

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Areas of Expertise:
Semiconductor Package
Fingerprint Sensor
Extreme Ultraviolet Radiation
Package Structure
Data Processing
Deep Neural Network
Die Bonding Pads
Substrate Processing
Integrated Fan-Out Package
Porous Conductive Structure
Manufacturing Method
Circuit Substrate
79 patents (USPTO):Explore Patents
1. 12757758 - Semiconductor package and manufacturing method of semiconductor package (2026-10-06),
2. 12653074 - Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device (2026-06-09),
3. 12557707 - Method of fabricating package structure (2026-02-17),
4. 12451396 - Semiconductor package and method of forming same (2025-10-21),
5. 12431446 - Package structure (2025-09-30),
6. 12399438 - Method and apparatus for removing contamination (2025-08-26),
7. 12394242 - Fingerprint sensor device and method (2025-08-19),
8. 12381163 - Semiconductor package and manufacturing method thereof (2025-08-05),
9. 12362274 - Package structure and method of forming the same (2025-07-15),
10. 12334956 - Data processing system and data processing method for deep neural network model (2025-06-17),
11. 12334434 - Package structure and method of forming the same (2025-06-17),
12. 12300644 - Die bonding pads and methods of forming the same (2025-05-13),
13. 12287589 - Method and apparatus for removing contamination (2025-04-29),
14. 12260669 - Fingerprint sensor in InFO structure and formation method (2025-03-25),
15. 12205860 - Sensor packages (2025-01-21),

Title: The Innovative Journey of Inventor Yu-Chih Huang

Introduction: Yu-Chih Huang is a pioneering inventor hailing from Hsinchu, Taiwan. His dedication to innovation and problem-solving has led to remarkable advancements in various fields.

Latest Patents: Yu-Chih Huang holds several cutting-edge patents in the areas of technology and engineering, showcasing his continuous commitment to pushing the boundaries of what is possible.

Career Highlights: Throughout his illustrious career, Yu-Chih Huang has been instrumental in developing groundbreaking technologies that have revolutionized industries. His keen eye for detail and inventive spirit have earned him recognition as a trailblazer in the world of innovation.

Collaborations: Yu-Chih Huang has collaborated with leading experts and organizations in the field, fostering a culture of creativity and excellence. His ability to work seamlessly in teams has resulted in the creation of transformative solutions that have left a lasting impact.

Conclusion: In conclusion, Yu-Chih Huang's relentless pursuit of innovation and his remarkable contributions to the world of inventions have solidified his position as a visionary inventor. His work continues to inspire future generations to think outside the box and strive for greatness in the realm of technology and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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