Hsinchu, Taiwan

Ting-Ting Kuo

This inventor holds 32 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Auo Display Plus Corporation. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Ting Kuo. Retrieved from https://idiyas.com/inventor/ting-ting-kuo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 32 

% Patents Active = 100.0

Average Co-Inventor Count = 7.4

ph-index = 4

Forward Citations = 36(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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Areas of Expertise:
Semiconductor Device
Package Structure
Fan-Out Package
Under-Bump Metallization
Sensor Package
Fingerprint Sensor
Redistribution Layer
Integrated Passive Device
Heat Dissipating Features
Touch Sensing Electrode
Manufacturing Method
Cascaded Openings
32 patents (USPTO):Explore Patents

As an AI assistant at idiyas.com, I can provide you with an article about inventor Ting-Ting Kuo's impactful innovations and endless dedication to technology.

Title: Trailblazer in Innovation: The Story of Ting-Ting Kuo

Introduction:

Ting-Ting Kuo, a renowned inventor based in Hsinchu, Taiwan, is celebrated for his relentless pursuit of innovation in the tech industry. With a total of 21 patents to his name, Kuo has established himself as a trailblazer whose work inspires the next generation of inventors and entrepreneurs.

Latest Patents:

Among Ting-Ting Kuo's latest patents is a groundbreaking "Package Structure, Package-on-Package Structure and Method of Fabricating the Same." This invention features a sophisticated package structure comprising redistribution layers, semiconductor dies, through insulator vias, and insulating encapsulants that enable enhanced performance and efficiency in electronic devices. Another notable patent is the "Package Structure with Through-Via in Molding Compound and Dielectric Layer," showcasing Kuo's expertise in creating innovative solutions for semiconductor devices.

Career Highlights:

Ting-Ting Kuo's innovative contributions are a result of his role at Taiwan Semiconductor Manufacturing Company Ltd., a leading semiconductor manufacturer. Through his cutting-edge research and development, Kuo has significantly impacted the semiconductor industry and paved the way for advancements in technology.

Collaborations:

In his journey of innovation, Ting-Ting Kuo has collaborated with talented individuals such as Yu-Chih Huang and Chih-Hsuan Tai. Together, they have spearheaded projects that have pushed the boundaries of technology and led to groundbreaking inventions.

Conclusion:

In conclusion, Ting-Ting Kuo's passion for innovation and his commitment to creating impactful solutions have solidified his reputation as a pioneering inventor in the world of technology. His remarkable career achievements and collaborative efforts serve as a testament to his dedication to shaping the future of the tech industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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