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For the Inventor, By the Inventor

Tainan, Taiwan

Ying-Cheng Tseng

USPTO Granted Patents = 27 

Average Co-Inventor Count = 7.8

ph-index = 3

Forward Citations = 24(Granted Patents)


Company Filing History:

goldMedal27 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2018-2025

where 'Filed Patents' based on already Granted Patents

27 patents (USPTO):
1. 12362274 - Package structure and method of forming the same (2025-07-15),
2. 12334434 - Package structure and method of forming the same (2025-06-17),
3. 12205860 - Sensor packages (2025-01-21),
4. 12113022 - Semiconductor package and manufacturing method of semiconductor package (2024-10-08),
5. 12051666 - Package structure and manufacturing method of package structure thereof (2024-07-30),
6. 12015017 - Package structure, package-on-package structure and method of fabricating the same (2024-06-18),
7. 11929318 - Package structure and method of forming the same (2024-03-12),
8. 11855232 - Semiconductor package and forming method thereof (2023-12-26),
9. 11847852 - Manufacturing method of fingerprint sensor (2023-12-19),
10. 11842993 - Semiconductor device with multiple polarity groups (2023-12-12),
11. 11742254 - Sensor package and method (2023-08-29),
12. 11631658 - Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device (2023-04-18),
13. 11580767 - Fingerprint sensor (2023-02-14),
14. 11527525 - Semiconductor device with multiple polarity groups (2022-12-13),
15. 11374136 - Semiconductor package and forming method thereof (2022-06-28),

Title: Innovations by Ying-Cheng Tseng in Semiconductor Technology

Introduction: Ying-Cheng Tseng is a prominent inventor located in Tainan, Taiwan, known for his remarkable contributions to the field of semiconductor technology. With an impressive portfolio of 25 patents, Tseng has developed innovative solutions that enhance the functionality and efficiency of various semiconductor devices.

Latest Patents: Two of his latest patents include groundbreaking developments in sensor packages and semiconductor manufacturing methods. The sensor package patent detailed an embodiment comprising a sensor die with a first surface and second surface, encapsulated by an innovatively designed encapsulant. This device also features a conductive via and a front-side redistribution structure that enhances connectivity and functionality. The second patent describes a sophisticated semiconductor package comprising lower and upper encapsulated semiconductor devices, interconnected by intricate redistribution structures, effectively optimizing the manufacturing processes and performance of semiconductor devices.

Career Highlights: Tseng's career is distinguished by his role at Taiwan Semiconductor Manufacturing Company Limited, where he employs his expertise to drive major advancements in semiconductor technology. His relentless pursuit of innovation has positioned him as a leading figure in the industry, continuously pushing the boundaries of what is technically feasible.

Collaborations: Throughout his career, Tseng has collaborated with esteemed coworkers, including Hao-Yi Tsai and Yu-Chih Huang. These partnerships have fostered an environment of teamwork and innovation, allowing for the sharing of ideas and resources that enhance product development and technological advancement.

Conclusion: Ying-Cheng Tseng's contributions to semiconductor technology through his numerous patents illustrate his significant impact on innovation within the industry. His ongoing work continues to inspire future advancements and solidifies his reputation as a leading inventor in semiconductor applications.

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