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Hsinchu, Taiwan

Tsung-Hsien Chiang

USPTO Granted Patents = 44 (Patent Applications = 10)

Average Co-Inventor Count = 6.0

ph-index = 4

Forward Citations = 69(Granted Patents)

Company Filing History:

44 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2014-2025

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Areas of Expertise:

Semiconductor Package

Integrated Circuit Package

Chip Package

Fan-Out Structure

Sensor Package

Wafer Level Packaging

Thermally Enhanced Package

Bonded Structures

Interconnect Structures

Dielectric Slots

Embedded Heat Spreader

Redistribution Layer

44 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12438007 - Staggered metal mesh on backside of device die and method forming same (2025-10-07),

2. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),

3. 12362329 - Method of fabricating semiconductor package (2025-07-15),

4. 12362274 - Package structure and method of forming the same (2025-07-15),

5. 12334434 - Package structure and method of forming the same (2025-06-17),

6. 12266639 - Method of fabricating semiconductor package (2025-04-01),

7. 12261126 - Semiconductor package (2025-03-25),

8. 12205860 - Sensor packages (2025-01-21),

9. 12159839 - Semiconductor packages (2024-12-03),

10. 12125797 - Package structure with fan-out feature (2024-10-22),

11. 12080653 - Formation method of chip package with fan-out structure (2024-09-03),

12. 11942433 - Integrated circuit package and method (2024-03-26),

13. 11935871 - Semiconductor package and method of fabricating the same (2024-03-19),

14. 11929318 - Package structure and method of forming the same (2024-03-12),

15. 11923318 - Method of manufacturing semiconductor package (2024-03-05),

Title: Tsung-Hsien Chiang: Innovator from Hsinchu

Introduction: Tsung-Hsien Chiang is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tsung-Hsien Chiang holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Tsung-Hsien Chiang has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Tsung-Hsien Chiang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous breakthroughs in the tech sector.

Conclusion: Tsung-Hsien Chiang's passion for innovation, coupled with his technical acumen and collaborative spirit, has solidified his reputation as a visionary inventor shaping the future of technology.

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