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For the Inventor, By the Inventor

Hsinchu, Taiwan

Tsung-Hsien Chiang

This inventor holds 46 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Hsien Chiang. Retrieved from https://idiyas.com/inventor/tsung-hsien-chiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 46 

% Patents Active = 95.7

Average Co-Inventor Count = 6.0

ph-index = 4

Forward Citations = 75(Granted Patents)


Company Filing History:

goldMedal46 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Package
Fan-Out Structure
Integrated Circuit
Thermal Management
Wafer Level
Sensor Packages
Chip Package
Bonded Structures
Dielectric Slots
Interconnect Structures
Package Structure
Heat Spreader
46 patents (USPTO):Explore Patents
1. 12660654 - Integrated fan-out package and manufacturing method thereof (2026-06-16),
2. 12564089 - Package structure (2026-02-24),
3. 12438007 - Staggered metal mesh on backside of device die and method forming same (2025-10-07),
4. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),
5. 12362329 - Method of fabricating semiconductor package (2025-07-15),
6. 12362274 - Package structure and method of forming the same (2025-07-15),
7. 12334434 - Package structure and method of forming the same (2025-06-17),
8. 12266639 - Method of fabricating semiconductor package (2025-04-01),
9. 12261126 - Semiconductor package (2025-03-25),
10. 12205860 - Sensor packages (2025-01-21),
11. 12159839 - Semiconductor packages (2024-12-03),
12. 12125797 - Package structure with fan-out feature (2024-10-22),
13. 12080653 - Formation method of chip package with fan-out structure (2024-09-03),
14. 11942433 - Integrated circuit package and method (2024-03-26),
15. 11935871 - Semiconductor package and method of fabricating the same (2024-03-19),

Title: Tsung-Hsien Chiang: Innovator from Hsinchu

Introduction: Tsung-Hsien Chiang is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tsung-Hsien Chiang holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Tsung-Hsien Chiang has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Tsung-Hsien Chiang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous breakthroughs in the tech sector.

Conclusion: Tsung-Hsien Chiang's passion for innovation, coupled with his technical acumen and collaborative spirit, has solidified his reputation as a visionary inventor shaping the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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