The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Mar. 18, 2022
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Kuo Wen Chen, Hsinchu, TW;
Hsiang-Tai Lu, Hsinchu County, TW;
Chih-Hsuan Tai, Taipei, TW;
Ming-Chung Wu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a substrate, a capacitor disposed in the substrate, an interconnect structure disposed over the substrate, and a first doped region disposed in the substrate. The interconnect structure includes a first via structure coupled to the substrate, and a second via structure coupled to the capacitor. The first doped region is disposed under the first via structure. The first doped region includes p-type or n-type dopants.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile