Company Filing History:
Years Active: 2023-2025
Title: The Innovations of Ming-Chung Wu
Introduction
Ming-Chung Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of innovative testing methods. His work has led to the filing of multiple patents, showcasing his expertise and creativity in this specialized area.
Latest Patents
Ming-Chung Wu holds two patents, with his latest focusing on a delamination sensor. This invention provides semiconductor structures and methods for testing them. The semiconductor structure includes a substrate and a semiconductor device positioned over it. The device features an interconnect structure composed of multiple metallization layers within a dielectric layer. The delamination sensor consists of a connecting structure and several contact vias located in at least one of the metallization layers. This connecting structure bonds the semiconductor device to the substrate without functionally coupling them. The contact vias are strategically placed within a specific region of the vertical projection area of the connecting structure, ensuring they do not overlap with another designated area.
Career Highlights
Ming-Chung Wu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves advancing semiconductor technologies and contributing to innovative solutions that enhance device performance and reliability.
Collaborations
Ming-Chung Wu has collaborated with several talented individuals in his field, including Chih-Hsuan Tai and Kuo-Wen Chen. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Ming-Chung Wu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, paving the way for future innovations in semiconductor structures and testing methods.