Hsinchu, Taiwan

Kuo Wen Chen

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo Wen Chen. Retrieved from https://idiyas.com/inventor/kuo-wen-chen-vd2adjm5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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2 patents (USPTO):Explore Patents

Title: Kuo Wen Chen: Innovator in Semiconductor Technology

Introduction

Kuo Wen Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Kuo Wen Chen holds a patent for a semiconductor package structure and method for forming the same. This patent describes a semiconductor structure that includes a substrate, a capacitor disposed in the substrate, an interconnect structure over the substrate, and a first doped region in the substrate. The interconnect structure features a first via structure coupled to the substrate and a second via structure coupled to the capacitor. The first doped region is located beneath the first via structure and contains either p-type or n-type dopants.

Career Highlights

Kuo Wen Chen is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has contributed to advancements in semiconductor packaging, enhancing the performance and reliability of electronic devices.

Collaborations

Some of his notable coworkers include Hsiang-tai Lu and Chih-Hsuan Tai, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Kuo Wen Chen's innovative work in semiconductor technology exemplifies the importance of research and development in advancing electronic components. His contributions continue to influence the industry and pave the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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