Hsinchu, Taiwan

Chung-Ming Weng

USPTO Granted Patents = 28 

Average Co-Inventor Count = 8.4

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2022-2025

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28 patents (USPTO):

Title: Innovations of Chung-Ming Weng in Photonic Integrated Circuits

Introduction

Chung-Ming Weng is a prominent inventor based in Hsinchu, Taiwan, known for his contributions to the field of photonic integrated circuits. With a remarkable portfolio that includes 23 patents, Weng has established himself as a key figure in advancing semiconductor technologies.

Latest Patents

Weng's recent innovations include significant patents that enhance integrated circuit packaging and manufacturing processes. One of the noteworthy patents is titled "Package and Method of Forming Same," which describes an integrated circuit package featuring a photonic integrated circuit die equipped with an optical coupler. This design aims to optimize the interaction between electronic and photonic components. Another significant patent, "Photonic Semiconductor Device and Method of Manufacture," details a package that includes a photonic layer on a substrate. This innovation incorporates a silicon waveguide connected to a grating coupler, enhancing the efficiency of optical signal transmission.

Career Highlights

Chung-Ming Weng is affiliated with Taiwan Semiconductor Manufacturing Company Ltd., where his work plays a crucial role in the development of advanced semiconductor technologies. His expertise in photonic integration is instrumental in driving innovations that improve performance and reliability in electronic devices.

Collaborations

Weng collaborates with talented colleagues such as Cheng-Chieh Hsieh and Hung-Yi Kuo, who contribute to various projects in the realm of semiconductor design and manufacturing. These collaborations foster an environment of innovation and knowledge sharing, leading to groundbreaking advancements in the industry.

Conclusion

Chung-Ming Weng's contributions to the field of photonic integrated circuits and semiconductor packaging are significant, as evidenced by his extensive patent portfolio. Through his innovative work at Taiwan Semiconductor Manufacturing Company Ltd. and collaborations with fellow researchers, Weng continues to push the boundaries of technology, paving the way for future advancements in the industry.

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