The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
May. 05, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chung-Ming Weng, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Hao-Yi Tsai, Hsinchu, TW;
Cheng-Chieh Hsieh, Tainan, TW;
Hung-Yi Kuo, Taipei, TW;
Tsung-Yuan Yu, Taipei, TW;
Hua-Kuei Lin, Hsinchu, TW;
Che-Hsiang Hsu, Taichung, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.