logo

For the Inventor, By the Inventor

Taipei, Taiwan

Tsung-Yuan Yu

This inventor holds 112 USPTO granted patents and 21 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-05). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Yuan Yu. Retrieved from https://idiyas.com/inventor/tsung-yuan-yu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 112 

% Patents Active = 88.4

Average Co-Inventor Count = 4.5

ph-index = 9

Forward Citations = 403(Granted Patents)

Forward Citations (Not Self Cited) = 353(Dec 10, 2025)


Inventors with similar research interests:

🔬 See more inventors

Location History:

  • Hsinchu, TW (2016 - 2023)
  • Taipei, TW (2012 - 2024)

Company Filing History:

goldMedal111 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2012-2026

Loading Chart...
Areas of Expertise:
Semiconductor Device
Optical Through Via
Photonic Integrated Circuit
Die Stacking Structure
Package Structure
Interconnect Structures
Manufacturing Method
Packaging Devices
Optical Interconnect
Semiconductor Package
Device Fabrication
Method of Manufacture
112 patents (USPTO):Explore Patents
1. 12660696 - Integrated circuit packages and methods of forming the same (2026-06-16),
2. 12613382 - Method of making semiconductor device including optical through via and method of using (2026-04-28),
3. 12610834 - Semiconductor device package structure and manufacturing method thereof (2026-04-21),
4. 12566302 - Package structure and method of forming the same (2026-03-03),
5. 12451417 - Semiconductor package and manufacturing method thereof (2025-10-21),
6. 12442995 - Photonic integrated circuit and package structure (2025-10-14),
7. 12362329 - Method of fabricating semiconductor package (2025-07-15),
8. 12360321 - Package structure, semiconductor device and method of fabricating the same (2025-07-15),
9. 12266639 - Method of fabricating semiconductor package (2025-04-01),
10. 12210200 - Photonic semiconductor device and method of manufacture (2025-01-28),
11. 12210188 - Semiconductor package and manufacturing method thereof (2025-01-28),
12. 12176282 - Manufacturing method of semiconductor package (2024-12-24),
13. 12164158 - Package having prism structure and manufacturing method thereof (2024-12-10),
14. 12132024 - Semiconductor package and method of manufacturing the same (2024-10-29),
15. 12105323 - Semiconductor package (2024-10-01),

Title: Tsung-Yuan Yu: A Visionary Inventor Shaping the Future of Technology

Introduction:

Tsung-Yuan Yu, a prominent figure in the world of inventors, has dedicated his life to innovation and the relentless pursuit of excellence. Hailing from Taipei, Taiwan, Yu has established himself as a true visionary in his field, inspiring countless individuals with his groundbreaking work.

Latest Patents:

With an impressive number of 97 patents to his name, Tsung-Yuan Yu continues to push the boundaries of technology. His latest patents include a Die Stacking Structure and Method Forming Same, which revolutionizes the packaging of electronic components, and a Package Structure featuring a photonic die, an electronic die, and a waveguide for advanced optical and electronic integration.

Career Highlights:

Tsung-Yuan Yu is currently making waves at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing. His innovative spirit and groundbreaking patents have played a pivotal role in shaping the future of TSMC and the semiconductor industry as a whole.

Collaborations:

Yu's collaborative efforts with colleagues such as Hsien-Wei Chen and Hao-Yi Tsai have led to the development of cutting-edge technologies that have transformed the way we think about electronics and photonics. Together, they form a formidable team driving innovation and progress in their respective fields.

Conclusion:

In conclusion, Tsung-Yuan Yu's dedication to innovation, coupled with his visionary approach to technology, has solidified his position as a pioneering inventor. His work continues to inspire and shape the future of technology, leaving a lasting impact on the industry and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…