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For the Inventor, By the Inventor

Taipei, Taiwan

Tsung-Yuan Yu

USPTO Granted Patents = 108 

Average Co-Inventor Count = 4.6

ph-index = 8

Forward Citations = 366(Granted Patents)

Forward Citations (Not Self Cited) = 353(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu, TW (2016 - 2023)
  • Taipei, TW (2012 - 2024)

Company Filing History:

goldMedal108 out of 40,927 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2025

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Areas of Expertise:
Semiconductor Packaging
Photonic Integrated Circuits
Optical Interconnects
Die Stacking Structures
Interconnect Structures
Wafer-Level Packaging
Manufacturing Methods
Strain Reduced Structures
Ball Height Control
Semiconductor Devices
Packaging Devices
Optical Through Via
108 patents (USPTO):Explore Patents
1. 12451417 - Semiconductor package and manufacturing method thereof (2025-10-21),
2. 12442995 - Photonic integrated circuit and package structure (2025-10-14),
3. 12362329 - Method of fabricating semiconductor package (2025-07-15),
4. 12360321 - Package structure, semiconductor device and method of fabricating the same (2025-07-15),
5. 12266639 - Method of fabricating semiconductor package (2025-04-01),
6. 12210200 - Photonic semiconductor device and method of manufacture (2025-01-28),
7. 12210188 - Semiconductor package and manufacturing method thereof (2025-01-28),
8. 12176282 - Manufacturing method of semiconductor package (2024-12-24),
9. 12164158 - Package having prism structure and manufacturing method thereof (2024-12-10),
10. 12132024 - Semiconductor package and method of manufacturing the same (2024-10-29),
11. 12105323 - Semiconductor package (2024-10-01),
12. 12002799 - Die stacking structure and method forming same (2024-06-04),
13. 11953740 - Package structure (2024-04-09),
14. 11947173 - Photonic semiconductor device and method of manufacture (2024-04-02),
15. 11935871 - Semiconductor package and method of fabricating the same (2024-03-19),

Title: Tsung-Yuan Yu: A Visionary Inventor Shaping the Future of Technology

Introduction:

Tsung-Yuan Yu, a prominent figure in the world of inventors, has dedicated his life to innovation and the relentless pursuit of excellence. Hailing from Taipei, Taiwan, Yu has established himself as a true visionary in his field, inspiring countless individuals with his groundbreaking work.

Latest Patents:

With an impressive number of 97 patents to his name, Tsung-Yuan Yu continues to push the boundaries of technology. His latest patents include a Die Stacking Structure and Method Forming Same, which revolutionizes the packaging of electronic components, and a Package Structure featuring a photonic die, an electronic die, and a waveguide for advanced optical and electronic integration.

Career Highlights:

Tsung-Yuan Yu is currently making waves at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing. His innovative spirit and groundbreaking patents have played a pivotal role in shaping the future of TSMC and the semiconductor industry as a whole.

Collaborations:

Yu's collaborative efforts with colleagues such as Hsien-Wei Chen and Hao-Yi Tsai have led to the development of cutting-edge technologies that have transformed the way we think about electronics and photonics. Together, they form a formidable team driving innovation and progress in their respective fields.

Conclusion:

In conclusion, Tsung-Yuan Yu's dedication to innovation, coupled with his visionary approach to technology, has solidified his position as a pioneering inventor. His work continues to inspire and shape the future of technology, leaving a lasting impact on the industry and beyond.

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