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For the Inventor, By the Inventor

Dajia, Taiwan

Shih-Wei Liang

USPTO Granted Patents = 78 

Average Co-Inventor Count = 4.7

ph-index = 8

Forward Citations = 229(Granted Patents)

Forward Citations (Not Self Cited) = 212(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Daija Township, TW (2015 - 2016)
  • Hsin-Chu, TW (2015 - 2017)
  • Taichung, TW (2015 - 2019)
  • Daijia Township, TW (2019)
  • Taichung County, TW (2013 - 2021)
  • Dajia Township, TW (2012 - 2022)
  • Dajia Township, Taichung County, TW (2019 - 2023)

Company Filing History:

goldMedal78 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2025

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Areas of Expertise:
Polymer Layers
Wireless Charging Device
Heat Dissipation
Semiconductor Packaging
Hybrid Bonding Structures
Electrical Connectors
Integrated Circuit
Solder Ball Protection
Chip Scale Packaging
Interconnection Structure
Manufacturing Method
Optical Sensing System
78 patents (USPTO):Explore Patents
1. 12412852 - Polymer layers embedded with metal pads for heat dissipation (2025-09-09),
2. 12322696 - Dual-mode wireless charging device (2025-06-03),
3. 12322670 - Methods and apparatus for package with interposers (2025-06-03),
4. 12218035 - Barrier structures between external electrical connectors (2025-02-04),
5. 11735518 - Dual-mode wireless charging device (2023-08-22),
6. 11398440 - Polymer layers embedded with metal pads for heat dissipation (2022-07-26),
7. RE49046 - Methods and apparatus for package on package devices (2022-04-18),
8. 11296012 - Barrier structures between external electrical connectors (2022-04-05),
9. 11114357 - Methods and apparatus for package with interposers (2021-09-07),
10. 11101238 - Surface mounting semiconductor components (2021-08-24),
11. 10985117 - Solder ball protection in packages (2021-04-20),
12. 10971463 - Interconnection structure including a metal post encapsulated by a joint material having concave outer surface (2021-04-06),
13. 10867957 - Mechanisms for forming hybrid bonding structures with elongated bumps (2020-12-15),
14. 10522437 - Methods and apparatus for package with interposers (2019-12-31),
15. 10510689 - Solder ball protection in packages (2019-12-17),

Title: The Innovative Journey of Inventor Shih-Wei Liang

Introduction: Shih-Wei Liang, a talented inventor hailing from Dajia Township, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Shih-Wei Liang holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: Throughout his illustrious career, Shih-Wei Liang has been at the forefront of technological advancements, with his inventions revolutionizing the way we interact with modern devices.

Collaborations: Shih-Wei Liang has collaborated with leading tech companies and research institutions, further solidifying his reputation as a visionary inventor with a keen eye for cutting-edge solutions.

Conclusion: In conclusion, Shih-Wei Liang's innovative spirit and relentless pursuit of excellence have cemented his legacy as a pioneering inventor, shaping the landscape of technology for years to come.

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