Shih-Wei Liang

This inventor holds 82 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-13). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 82 (Patent Applications = 5)

% Patents Active = 84.1

Average Co-Inventor Count = 4.7

ph-index = 8

Forward Citations = 242(Granted Patents)

Forward Citations (Not Self Cited) = 212(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Daija Township, TW (2015 - 2016)
Hsin-Chu, TW (2015 - 2017)
Taichung, TW (2015 - 2019)
Daijia Township, TW (2019)
Taichung County, TW (2013 - 2021)
Dajia Township, TW (2012 - 2022)
Dajia Township, Taichung County, TW (2019 - 2023)

Company Filing History:

82 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

Semiconductor Device

Dual-Mode Wireless Charging

Heat Dissipation

Bonding Structures

Interconnection

Polymer Layers

Solder Ball Protection

Integrated Circuit

Package Structures

Electrical Connections

Manufacturing Method

Chip Scale Packaging

82 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12748271 - Silicon-based optical component and method of forming the same (2026-09-29),

2. 12717096 - Integrated fiber array unit structure including embedded passive optical components and method for forming the same (2026-08-25),

3. 12642096 - Semiconductor device and method for forming the same (2026-05-26),

4. 12610854 - Semiconductor device structure with bonding pad and method for forming the same (2026-04-21),

5. 12412852 - Polymer layers embedded with metal pads for heat dissipation (2025-09-09),

6. 12322696 - Dual-mode wireless charging device (2025-06-03),

7. 12322670 - Methods and apparatus for package with interposers (2025-06-03),

8. 12218035 - Barrier structures between external electrical connectors (2025-02-04),

9. 11735518 - Dual-mode wireless charging device (2023-08-22),

10. 11398440 - Polymer layers embedded with metal pads for heat dissipation (2022-07-26),

11. RE49046 - Methods and apparatus for package on package devices (2022-04-18),

12. 11296012 - Barrier structures between external electrical connectors (2022-04-05),

13. 11114357 - Methods and apparatus for package with interposers (2021-09-07),

14. 11101238 - Surface mounting semiconductor components (2021-08-24),

15. 10985117 - Solder ball protection in packages (2021-04-20),

Title: The Innovative Journey of Inventor Shih-Wei Liang

Introduction: Shih-Wei Liang, a talented inventor hailing from Dajia Township, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Shih-Wei Liang holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: Throughout his illustrious career, Shih-Wei Liang has been at the forefront of technological advancements, with his inventions revolutionizing the way we interact with modern devices.

Collaborations: Shih-Wei Liang has collaborated with leading tech companies and research institutions, further solidifying his reputation as a visionary inventor with a keen eye for cutting-edge solutions.

Conclusion: In conclusion, Shih-Wei Liang's innovative spirit and relentless pursuit of excellence have cemented his legacy as a pioneering inventor, shaping the landscape of technology for years to come.