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For the Inventor, By the Inventor

Dajia, Taiwan

Shih-Wei Liang

USPTO Granted Patents = 78 

Average Co-Inventor Count = 4.7

ph-index = 8

Forward Citations = 228(Granted Patents)

Forward Citations (Not Self Cited) = 212(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Daija Township, TW (2015 - 2016)
  • Hsin-Chu, TW (2015 - 2017)
  • Taichung, TW (2015 - 2019)
  • Daijia Township, TW (2019)
  • Taichung County, TW (2013 - 2021)
  • Dajia Township, TW (2012 - 2022)
  • Dajia Township, Taichung County, TW (2019 - 2023)

Company Filing History:

goldMedal78 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2025

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78 patents (USPTO):
1. 12412852 - Polymer layers embedded with metal pads for heat dissipation (2025-09-09),
2. 12322696 - Dual-mode wireless charging device (2025-06-03),
3. 12322670 - Methods and apparatus for package with interposers (2025-06-03),
4. 12218035 - Barrier structures between external electrical connectors (2025-02-04),
5. 11735518 - Dual-mode wireless charging device (2023-08-22),
6. 11398440 - Polymer layers embedded with metal pads for heat dissipation (2022-07-26),
7. RE49046 - Methods and apparatus for package on package devices (2022-04-18),
8. 11296012 - Barrier structures between external electrical connectors (2022-04-05),
9. 11114357 - Methods and apparatus for package with interposers (2021-09-07),
10. 11101238 - Surface mounting semiconductor components (2021-08-24),
11. 10985117 - Solder ball protection in packages (2021-04-20),
12. 10971463 - Interconnection structure including a metal post encapsulated by a joint material having concave outer surface (2021-04-06),
13. 10867957 - Mechanisms for forming hybrid bonding structures with elongated bumps (2020-12-15),
14. 10522437 - Methods and apparatus for package with interposers (2019-12-31),
15. 10510689 - Solder ball protection in packages (2019-12-17),

Title: The Innovative Journey of Inventor Shih-Wei Liang

Introduction: Shih-Wei Liang, a talented inventor hailing from Dajia Township, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Shih-Wei Liang holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: Throughout his illustrious career, Shih-Wei Liang has been at the forefront of technological advancements, with his inventions revolutionizing the way we interact with modern devices.

Collaborations: Shih-Wei Liang has collaborated with leading tech companies and research institutions, further solidifying his reputation as a visionary inventor with a keen eye for cutting-edge solutions.

Conclusion: In conclusion, Shih-Wei Liang's innovative spirit and relentless pursuit of excellence have cemented his legacy as a pioneering inventor, shaping the landscape of technology for years to come.

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