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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11101238 B1

PDFFull Text
Date of Patent:
Aug. 24, 2021

Filed:

Mar. 20, 2018

Surface mounting semiconductor components

Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Ming-Kai Liu, Hsinchu, TW;

Chun-Lin Lu, Hsinchu, TW;

Kai-Chiang Wu, Hsinchu, TW;

Shih-Wei Liang, Taichung County, TW;

Ching-Feng Yang, Taipei, TW;

Yen-Ping Wang, Changhua County, TW;

Chia-Chun Miao, Taichung, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;

Attorneys:

WPAT, P.C., Intellectual Property Attorneys

Anthony King

Primary Examiner:

Thao X Le

Assistant Examiner:

Xia L Cross

Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/13 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/06152 (2013.01); H01L 2224/06179 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13028 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14152 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/14515 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16106 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/17104 (2013.01); H01L 2224/17515 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01322 (2013.01);
Abstract

A surface mounting semiconductor component includes a semiconductor device, a circuit board, a number of first solder bumps, and a number of second solder bumps. The semiconductor device included a number of die pads. The circuit board includes a number of contact pads. The first solder bumps are configured to bond the semiconductor device and the circuit board. Each of the first solder bumps connects at least two die pads with a corresponding contact pad. Each of the second solder bumps connects a die pad with a corresponding contact pad.

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