For the Inventor, By the Inventor

Enter inventor name

Hsinchu, Taiwan

Chun-Lin Lu

USPTO Granted Patents = 78 (Patent Applications = 11)

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 292(Granted Patents)

Forward Citations (Not Self Cited) = 276(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

70 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Powerchip Semiconductor Manufacturing Corporation

1 out of 832,843

Other

patents

where one patent can have more than one assignee

Years Active: 2014-2025

Loading Chart...

Areas of Expertise:

Semiconductor Structure

Wafer Bonding

Integrated Fan-Out Package

Through-Substrate Via

Hybrid Bonding Structures

Package Structure

Interconnection Structure

Semiconductor Device

Multilayer Stacking

Test Structure

Antenna Pattern

Packaging Methods

78 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12394686 - Semiconductor structure and manufacturing method thereof (2025-08-19),

2. 12354921 - Wafer structure including probe marked test pads (2025-07-08),

3. 12354870 - Multilayer stacking wafer bonding structure and method of manufacturing the same (2025-07-08),

4. 12327777 - Semiconductor package structure and manufacturing method thereof (2025-06-10),

5. 12322691 - Package structure and method of manufacturing the same (2025-06-03),

6. 12322670 - Methods and apparatus for package with interposers (2025-06-03),

7. 12278149 - Through-substrate via test structure (2025-04-14),

8. 12132247 - Semiconductor package and manufacturing method thereof (2024-10-29),

9. 12119303 - Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof (2024-10-15),

10. 12057358 - Package structure with antenna pattern (2024-08-06),

11. 12046480 - Manufacturing method of a semiconductor device (2024-07-23),

12. 11967558 - Wafer stacking structure and manufacturing method thereof (2024-04-23),

13. 11908787 - Package structure and method of manufacturing the same (2024-02-20),

14. 11894330 - Methods of manufacturing a semiconductor device including a joint adjacent to a post (2024-02-06),

15. 11854992 - Semiconductor structure and manufacturing method thereof (2023-12-26),

Title: The Innovative Journey of Inventor Chun-Lin Lu

Introduction: Chun-Lin Lu, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chun-Lin Lu holds several patents in the areas of semiconductor technology and electronic devices, showcasing his expertise and creativity in these domains.

Career Highlights: Throughout his illustrious career, Chun-Lin Lu has worked tirelessly to push the boundaries of technological advancements. His dedication and passion for innovation have led to the development of cutting-edge solutions that have revolutionized the industry.

Collaborations: Chun-Lin Lu has collaborated with leading tech companies and research institutions to further his research and bring his inventions to life. His ability to work in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Chun-Lin Lu stands as a beacon of innovation in the field of technology, with a remarkable track record of patents and inventions that have left a lasting impact on the industry. His relentless pursuit of excellence and commitment to pushing the boundaries of what is possible make him a true pioneer in his field.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…