Chun-Lin Lu

This inventor holds 82 USPTO granted patents and 23 published patent applications, primarily in Semiconductor Packaging (CPC class H01L2224-0401). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Powerchip Semiconductor Manufacturing Corporation, Other. Active years: 2014-2026.

USPTO Granted Patents = 82 (Patent Applications = 23)

% Patents Active = 92.7

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 304(Granted Patents)

Forward Citations (Not Self Cited) = 276(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

72 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

10 out of 190

Powerchip Semiconductor Manufacturing Corporation

patents

1 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 2014-2026

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Areas of Expertise:

Wafer Stacking

Semiconductor Structure

Package Structure

Interposers

3D Integrated Circuit

Fan-Out Package

Through-Substrate Via

Test Structure

Antenna Pattern

Manufacturing Methods

Thermal Management

Redistribution Circuits

82 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12708000 - Semiconductor structure and manufacturing method thereof (2026-08-11),

2. 12610797 - Wafer stacking process (2026-04-21),

3. 12564017 - Wafer stacking method (2026-02-24),

4. 12512424 - Package, package structure and method of manufacturing the same (2025-12-30),

5. 12394686 - Semiconductor structure and manufacturing method thereof (2025-08-19),

6. 12354921 - Wafer structure including probe marked test pads (2025-07-08),

7. 12354870 - Multilayer stacking wafer bonding structure and method of manufacturing the same (2025-07-08),

8. 12327777 - Semiconductor package structure and manufacturing method thereof (2025-06-10),

9. 12322691 - Package structure and method of manufacturing the same (2025-06-03),

10. 12322670 - Methods and apparatus for package with interposers (2025-06-03),

11. 12278149 - Through-substrate via test structure (2025-04-14),

12. 12132247 - Semiconductor package and manufacturing method thereof (2024-10-29),

13. 12119303 - Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof (2024-10-15),

14. 12057358 - Package structure with antenna pattern (2024-08-06),

15. 12046480 - Manufacturing method of a semiconductor device (2024-07-23),

Title: The Innovative Journey of Inventor Chun-Lin Lu

Introduction: Chun-Lin Lu, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chun-Lin Lu holds several patents in the areas of semiconductor technology and electronic devices, showcasing his expertise and creativity in these domains.

Career Highlights: Throughout his illustrious career, Chun-Lin Lu has worked tirelessly to push the boundaries of technological advancements. His dedication and passion for innovation have led to the development of cutting-edge solutions that have revolutionized the industry.

Collaborations: Chun-Lin Lu has collaborated with leading tech companies and research institutions to further his research and bring his inventions to life. His ability to work in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Chun-Lin Lu stands as a beacon of innovation in the field of technology, with a remarkable track record of patents and inventions that have left a lasting impact on the industry. His relentless pursuit of excellence and commitment to pushing the boundaries of what is possible make him a true pioneer in his field.