The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

May. 15, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Sheng-Ta Lin, Miaoli County, TW;

Chun-Lin Lu, Hsinchu, TW;

Kai-Chiang Wu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); H01L 21/563 (2013.01); H01L 21/76802 (2013.01); H01L 21/78 (2013.01); H01L 23/5384 (2013.01); H01L 23/66 (2013.01); H01L 24/94 (2013.01); H01Q 1/2283 (2013.01);
Abstract

Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.


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