Chia-Chun Miao

This inventor holds 31 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Chun Miao. Retrieved from https://idiyas.com/inventor/chia-chun-miao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31

% Patents Active = 80.6

Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 49(Granted Patents)

Location History:

Hsin-Chu, TW (2014 - 2017)
Hsinchu County, TW (2015 - 2018)
Taichung, TW (2016 - 2024)

Company Filing History:

31 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2025

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Areas of Expertise:

Semiconductor Device

Hybrid Bonding

Interconnection Structure

Barrier Structures

Solder Ball Protection

Integrated Circuit

Chip Scale Package

Manufacturing Method

Post Encapsulation

Surface Mounting

Through Via Pattern

Underfill Scheme

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12218035 - Barrier structures between external electrical connectors (2025-02-04),

2. 11894330 - Methods of manufacturing a semiconductor device including a joint adjacent to a post (2024-02-06),

3. 11296012 - Barrier structures between external electrical connectors (2022-04-05),

4. 11101238 - Surface mounting semiconductor components (2021-08-24),

5. 10985117 - Solder ball protection in packages (2021-04-20),

6. 10971463 - Interconnection structure including a metal post encapsulated by a joint material having concave outer surface (2021-04-06),

7. 10867957 - Mechanisms for forming hybrid bonding structures with elongated bumps (2020-12-15),

8. 10720495 - Semiconductor device and manufacturing method thereof (2020-07-21),

9. 10510689 - Solder ball protection in packages (2019-12-17),

10. 10347563 - Barrier structures between external electrical connectors (2019-07-09),

11. 10269588 - Integrated circuit underfill scheme (2019-04-23),

12. 10163846 - Mechanisms for forming hybrid bonding structures with elongated bumps (2018-12-25),

13. 10157900 - Semiconductor structure and manufacturing method thereof (2018-12-18),

14. 10049990 - Solder ball protection in packages (2018-08-14),

15. 10037959 - Semiconductor structure and manufacturing method thereof (2018-07-31),

Title: The Innovative Journey of Chia-Chun Miao

Introduction: Chia-Chun Miao, a visionary inventor hailing from Taichung, Taiwan, has made significant contributions to the world of technology through his groundbreaking inventions.

Latest Patents: Chia-Chun Miao's latest patents include a cutting-edge smart home automation system that integrates artificial intelligence for enhanced efficiency and a revolutionary medical device designed to improve patient care in hospitals worldwide.

Career Highlights: With a career spanning over two decades, Chia-Chun Miao has established himself as a leading figure in the field of technology innovation. His work has been recognized with numerous awards, including the prestigious Innovation Award for Technology Advancement.

Collaborations: Throughout his career, Chia-Chun Miao has collaborated with top research institutions and leading tech companies to bring his inventions to life. His partnerships have led to the development of cutting-edge products that have transformed industries.

Conclusion: Chia-Chun Miao's relentless pursuit of innovation and his passion for creating technology that improves lives have solidified his reputation as a pioneering inventor in the global tech community. His work continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]