The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Jun. 12, 2014
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Tsung-Yuan Yu, Taipei, TW;
Hao-Yi Tsai, Hsinchu, TW;
Chao-Wen Shih, Hsinchu County, TW;
Hung-Yi Kuo, Taipei, TW;
Chia-Chun Miao, Taichung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0657 (2013.01); H01L 21/3043 (2013.01); H01L 21/78 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/94 (2013.01); H01L 2924/35 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A semiconductor device includes a substrate and a bump. The substrate includes a first surface and a second surface. A notch is at the second surface and at a sidewall of the substrate. A depth of the notch is smaller than about half the thickness of the substrate. The bump is disposed on the first surface of the substrate.