IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Ching-Feng Yang

USPTO Granted Patents = 45 

Average Co-Inventor Count = 5.5

ph-index = 6

Forward Citations = 267(Granted Patents)


Company Filing History:

goldMedal45 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2025

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45 patents (USPTO):
1. 12412852 - Polymer layers embedded with metal pads for heat dissipation (2025-09-09),
2. 12322670 - Methods and apparatus for package with interposers (2025-06-03),
3. 12131986 - Semiconductor package and manufacturing method thereof (2024-10-29),
4. 12046480 - Manufacturing method of a semiconductor device (2024-07-23),
5. 11894330 - Methods of manufacturing a semiconductor device including a joint adjacent to a post (2024-02-06),
6. 11658105 - Semiconductor package and manufacturing method thereof (2023-05-23),
7. 11574857 - Semiconductor package and manufacturing method thereof (2023-02-07),
8. 11398440 - Polymer layers embedded with metal pads for heat dissipation (2022-07-26),
9. 11373922 - Semiconductor packages having thermal through vias (TTV) (2022-06-28),
10. 11233019 - Manufacturing method of semicondcutor package (2022-01-25),
11. 11211339 - Semiconductor device (2021-12-28),
12. 11114357 - Methods and apparatus for package with interposers (2021-09-07),
13. 11101238 - Surface mounting semiconductor components (2021-08-24),
14. 11018083 - Semiconductor package and manufacturing method thereof (2021-05-25),
15. 10971463 - Interconnection structure including a metal post encapsulated by a joint material having concave outer surface (2021-04-06),

Title: Trailblazing Inventor: Ching-Feng Yang

Introduction:

Ching-Feng Yang is a pioneering inventor based in Taipei, Taiwan, known for his profound impact on the field of semiconductor device manufacturing. With 42 patents to his name, he has cemented his reputation as a trailblazer in the world of inventions.

Latest Patents:

Among his latest patents is a groundbreaking method of manufacturing a semiconductor device. This innovative process involves surrounding a semiconductor die with a dielectric material, forming a post passivation interconnect (PPI), and molding the components into an integrated semiconductor package. Additionally, Ching-Feng Yang's method includes creating a conductive layer over the package's outer surface, forming a conductive path inside the device. Another patent focuses on techniques for manufacturing a semiconductor device with a joint adjacent to a post, emphasizing flat contact interfaces.

Career Highlights:

Ching-Feng Yang's career thrives at Taiwan Semiconductor Manufacturing Co. Ltd., a prominent player in the semiconductor industry. His contributions to the company's innovative endeavors have significantly advanced semiconductor manufacturing processes and technologies.

Collaborations:

In his professional journey, Ching-Feng Yang has collaborated closely with talented individuals in the field. Notable coworkers include Kai-Chiang Wu and Shih-Wei Liang, who have played key roles in driving forward cutting-edge advancements in semiconductor technology alongside him.

Conclusion:

Ching-Feng Yang's unwavering dedication to innovation and his remarkable contributions to the semiconductor industry underscore his status as a visionary inventor. His work serves as an inspiration to future generations of inventors and innovators, shaping the landscape of technological progress for years to come.

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