The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
Dec. 04, 2019
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chuei-Tang Wang, Taichung, TW;
Vincent Chen, Taipei, TW;
Tzu-Chun Tang, Kaohsiung, TW;
Chen-Hua Yu, Hsinchu, TW;
Ching-Feng Yang, Taipei, TW;
Ming-Kai Liu, Hsinchu, TW;
Yen-Ping Wang, Changhua County, TW;
Kai-Chiang Wu, Hsinchu, TW;
Shou Zen Chang, Hsinchu, TW;
Wei-Ting Lin, Taipei, TW;
Chun-Lin Lu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.