Kaohsiung, Taiwan

Tzu-Chun Tang

This inventor holds 36 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Sun Yat-Sen University of Kaohsiung, Tai-Saw Technology Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzu-Chun Tang. Retrieved from https://idiyas.com/inventor/tzu-chun-tang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 36 

% Patents Active = 97.2

Average Co-Inventor Count = 5.1

ph-index = 6

Forward Citations = 242(Granted Patents)


Location History:

  • Taoyuan County, TW (2016)
  • Kaohsiung, TW (2015 - 2024)

Company Filing History:


Years Active: 2015-2026

Loading Chart...
Areas of Expertise:
Semiconductor Package
Integrated Fan-Out Package
Wireless Charging
Thermally Conductive Layer
Electronic Apparatus
Antenna System
Stacked Coil
MIMO Antenna
Fabrication Method
Electronic Device
Packaging Methods
Semiconductor Device
36 patents (USPTO):Explore Patents

Title: Tzu-Chun Tang: A Pioneer in Innovation

Introduction:

Tzu-Chun Tang, a distinguished inventor hailing from Kaohsiung, Taiwan, is renowned for his passion for innovation and his relentless drive to push the boundaries of technology. With an impressive portfolio of 29 patents, his contributions to the world of inventions have solidified his position as a true pioneer in the field.

Latest Patents:

1. Integrated Fan-Out Package:

- The integrated fan-out (InFO) package designed by Tzu-Chun Tang includes a sophisticated array of components such as a die, encapsulant, redistribution structure, slot antenna, insulating layer, conductive structures, and antenna confinement structure. This innovative design showcases his deep understanding of packaging technology.

2. Semiconductor Package and Manufacturing Method Thereof:

- Tzu-Chun Tang's semiconductor package features an integrated circuit (IC) structure, insulating encapsulation, and redistribution structure that are meticulously crafted to ensure optimal performance. The manufacturing method he developed exemplifies his attention to detail and commitment to quality.

Career Highlights:

Throughout his illustrious career, Tzu-Chun Tang has made significant contributions to renowned companies such as Taiwan Semiconductor Manufacturing Company Limited (TSMC) and National Sun Yat-sen University. His innovative spirit and technical expertise have played a pivotal role in shaping the semiconductor industry.

Collaborations:

Tzu-Chun Tang's collaborative work with esteemed colleagues such as Chuei-Tang Wang and Chen-Hua Douglas Yu has led to the development of groundbreaking technologies that have revolutionized the field of semiconductor packaging. Their collective efforts have paved the way for new advancements and have garnered recognition in the industry.

Conclusion:

In conclusion, Tzu-Chun Tang's unwavering dedication to innovation, coupled with his remarkable technical acumen, has established him as a trailblazer in the world of inventions. His invaluable contributions continue to inspire future generations of inventors and serve as a testament to the transformative power of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…