The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Apr. 13, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Tzu-Chun Tang, Kaohsiung, TW;
Chung-Hao Tsai, Changhua County, TW;
Chen-Hua Yu, Hsinchu, TW;
Chuei-Tang Wang, Taichung, TW;
Chia-Chia Lin, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Provided is a package structure including a first die; a plurality of through vias, aside the first die; a first encapsulant laterally encapsulating the first die and the plurality of through vias; a first redistribution layer (RDL) structure on first sides of the first die, plurality of through vias, and the first encapsulant; a second RDL structure on second sides of the first die, the plurality of through vias, and the first encapsulant; and a plurality of conductive connectors, electrically connected to the second RDL structure. Portions of the first RDL structure, the plurality of through vias, and the second RDL structure are electrically connected to each other and form a solenoid inductor laterally aside the first die.