Chuei-Tang Wang

Taichung, Taiwan

Chuei-Tang Wang

This inventor holds 239 USPTO granted patents and 73 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-19). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd., Universal Scientific Industrial Co., Ltd.. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chuei-Tang Wang. Retrieved from https://idiyas.com/inventor/chuei-tang-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 239 

% Patents Active = 95.0

Average Co-Inventor Count = 4.2

ph-index = 13

Forward Citations = 1,035(Granted Patents)

Forward Citations (Not Self Cited) = 846(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsin-Chu, TW (2017 - 2018)
  • Taichung, TW (2006 - 2024)

Company Filing History:


Years Active: 2006-2026

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Areas of Expertise:
Semiconductor Package
Integrated Circuit
Photonic Device
Memory Packages
Chip Stack Structure
Heat Dissipation
Manufacturing Method
Optical Computing
Architecture
Electronic Apparatus
Deep Trench Capacitor
Polymer Layers
239 patents (USPTO):Explore Patents

Title: Chuei-Tang Wang: Innovations and Patents that Redefine Technology

Introduction:

Chuei-Tang Wang, hailing from Taichung, TW, is renowned for his groundbreaking contributions and remarkable achievements in the field of technological advancements. With an extensive collection of patents to his credit, Wang's innovative solutions have propelled the industry forward, leaving a lasting impact. In this article, we will delve into his latest patents, career highlights, notable collaborations, and the significance of his contributions.

Latest Patents:

One of Wang's recent patents, "Deep Partition Power Delivery with Deep Trench Capacitor," addresses the bonding of a capacitor die to a device die. This method involves integrating a capacitor electrically coupled to the device die, creating a robust power delivery mechanism. Another notable patent, "Package Structure, Package-on-Package Structure and Manufacturing Method Thereof," introduces a package design incorporating an interposer, redistribution layer, and through insulator vias. This innovation aims to enhance efficiency and connectivity in semiconductor packaging.

Career Highlights:

Over the course of his illustrious career, Wang has amassed an impressive portfolio of patents, totaling an impressive 173. These patents span various technological domains, showcasing his versatility and expertise. Wang's relentless pursuit of innovation has earned him numerous accolades, solidifying his position as a pioneer in his field.

Collaborations:

Wang has made significant contributions while working with esteemed companies such as Taiwan Semiconductor Manufacturing Company (TSMC) and Universal Scientific Industrial Co., Ltd. His collaborations with these industry-leading organizations have further strengthened his influence in the technological landscape. Notably, Wang has had the privilege of collaborating with colleagues like Chen-Hua Yu and Chung-Hao Tsai, who have made significant contributions alongside him.

Conclusion:

Chuei-Tang Wang's remarkable career journey and multitude of patents illustrate his boundless passion for pushing technological boundaries. His inventive solutions, such as the deep partition power delivery and package-on-package structures, have the potential to revolutionize various industry domains. Through his collaborations and relentless pursuit of innovation, Wang has cemented his position as an influential figure in the world of technology. As we eagerly anticipate his future contributions, it is evident that Chuei-Tang Wang's inventive prowess continues to shape and redefine the technological landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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