logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12696810 B1

PDFFull Text
Date of Patent:
Jul. 28, 2026

Filed:

May. 16, 2023

Package structure and method for forming the same

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Chia Lin, Kaohsiung City, TW;

Chih-Hsin Lu, Tainan City, TW;

Chung-Hao Tsai, Changhua County, TW;

Hsing-Kuo Hsia, Hsinchu County, TW;

Chuei-Tang Wang, Taichung City, TW;

Chen-Hua Yu, Hsinchu City, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Telly D Green

Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10B 80/00 (2026.01); H10W 70/05 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/15 (2026.01); H10W 80/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10B 80/00 (2023.02); H10W 70/095 (2026.01); H10W 74/012 (2026.01); H10W 74/131 (2026.01); H10W 74/15 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/794 (2026.01);
Abstract

A package structure is provided, and includes an interposer, a control unit, a plurality of computing units, a signal transmission layer, and an electric-optical material. The control unit is bonded to the interposer. The computing units are disposed around and connected to the control unit. The signal transmission layer is formed in the control unit and the computing units. The electric-optical material is formed in the control unit and the computing units, and the electric-optical material overlaps the signal transmission layer.

Find Patent Forward Citations

Lin, Chia-Chia. (2026). Package structure and method for forming the same (U.S. Patent No. 12696810). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12696810

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…