Chung-Hao Tsai

This inventor holds 117 USPTO granted patents and 39 published patent applications, primarily in Semiconductor Packaging (CPC class H01L23-481). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 117 (Patent Applications = 39)

% Patents Active = 94.9

Average Co-Inventor Count = 4.4

ph-index = 8

Forward Citations = 347(Granted Patents)

Forward Citations (Not Self Cited) = 265(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Hsin-Chu, TW (2017 - 2023)
Huatan Township, TW (2014 - 2024)
Changhua County, TW (2016 - 2024)

Company Filing History:

114 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 465

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Semiconductor Package

Integrated Circuit

Photonic Device

Memory Packages

Manufacturing Method

Thermal Management

Die Stacks

Antenna Device

Optical Computing

Power Delivery

Package Structure

Electronic Apparatus

117 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12748256 - Optical devices (2026-09-29),

2. 12733507 - Package structure and manufacturing method thereof (2026-09-08),

3. 12713628 - STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAPACITOR (2026-08-18),

4. 12696810 - Package structure and method for forming the same (2026-07-28),

5. 12660594 - Chip package structure with substrates and method for forming the same (2026-06-16),

6. 12648495 - Package structure and manufacturing method thereof (2026-06-02),

7. 12631820 - Silicon-based photonic quantum memory devices and methods for forming the same (2026-05-19),

8. 12599009 - Package structure (2026-04-07),

9. 12588222 - Semiconductor package including an integrated circuit die and an inductor or a transformer (2026-03-24),

10. 12560829 - Photonic semiconductor device and method (2026-02-24),

11. 12546935 - Integrated circuit package and method of forming same (2026-02-10),

12. 12538851 - Memory packages and methods of forming same (2026-01-27),

13. 12517301 - Photon source and optical computing architecture (2026-01-06),

14. 12512424 - Package, package structure and method of manufacturing the same (2025-12-30),

15. 12512405 - Semiconductor package and method of manufacturing the same (2025-12-30),

Title: The Innovative Journey of Inventor Chung-Hao Tsai

Introduction:

Chung-Hao Tsai, a talented inventor hailing from Changhua County, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents:

Chung-Hao Tsai holds several patents in the areas of electronics and telecommunications, showcasing his continuous dedication to innovation and creativity.

Career Highlights:

Throughout his illustrious career, Chung-Hao Tsai has worked tirelessly to develop cutting-edge technologies that have revolutionized the industry. His commitment to excellence and passion for innovation have earned him recognition as a pioneer in his field.

Collaborations:

Chung-Hao Tsai has collaborated with leading tech companies and research institutions to further his inventions and bring them to the market. His ability to work effectively in a team setting has led to the successful implementation of his groundbreaking ideas.

Conclusion:

Inventor Chung-Hao Tsai's relentless pursuit of innovation and his remarkable contributions to the field of technology have solidified his reputation as a visionary inventor. His work continues to inspire future generations of inventors to push the boundaries of what is possible in the world of technology.