The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jul. 14, 2022
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chuei-Tang Wang, Taichung, TW;
Wen-Hao Cheng, Hsinchu, TW;
Tung-Liang Shao, Hsinchu, TW;
Chung-Hao Tsai, Huatan Township, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A package includes an encapsulant having a first side and a second side opposite to the first side, a first integrated circuit die and a second integrated circuit die embedded in the encapsulant, and a first interposer on the first side of the encapsulant. The first interposer is mechanically and electrically coupled to the first integrated circuit die and the second integrated circuit die. The package further includes a second interposer on the second side of the encapsulant. The second interposer is mechanically and electrically coupled to the first integrated circuit die and the second integrated circuit die. The second interposer optically or electrically couples the first integrated circuit die to the second integrated circuit die.