The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jan. 10, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chuei-Tang Wang, Taichung City, TW;
Tso-Jung Chang, Taoyuan City, TW;
Jeng-Shien Hsieh, Kaohsiung, TW;
Shih-Ping Lin, Taichung City, TW;
Chih-Peng Lin, Hsinchu County, TW;
Chieh-Yen Chen, Taipei City, TW;
Chen-Hua Yu, Hsinchu City, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure. The redistribution circuit structure is disposed between the first tier and the second tier, where the at least one first die is electrically connected to and electrically communicated with the plurality of second dies through the redistribution circuit structure, and the plurality of second dies are electrically connected to and electrically communicated with each other through the redistribution circuit structure.