This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Shih-Ping Lin: Innovator in Chip Stack Structures
Introduction: Shih-Ping Lin is an inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of chip stack structures. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications: Shih-Ping Lin's recent patent applications include "CHIP STACK STRUCTURE WITH CONDUCTIVE PLUG AND METHOD FOR FORMING THE SAME." This application describes a chip stack structure that features a first chip with a first substrate and interconnect structure, which includes a dielectric layer and bonding pad. The structure also incorporates a second chip that is bonded to the first chip, with interconnect structures and bonding pads that facilitate connectivity between the two chips. Another notable application is "STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS." This application outlines a method for bonding memory-containing chip structures and logic control chip structures through advanced bonding techniques.
Conclusion: Shih-Ping Lin's work in chip stack structures showcases his innovative approach to semiconductor technology. His latest patent applications highlight his commitment to advancing the field, even as he seeks to secure granted patents in the future.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile