The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2021
Filed:
Dec. 16, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Tzu-Chun Tang, Kaohsiung, TW;
Chuei-Tang Wang, Taichung, TW;
Chun-Lin Lu, Hsinchu, TW;
Wei-Ting Chen, Tainan, TW;
Vincent Chen, Taipei, TW;
Shou-Zen Chang, Hsinchu, TW;
Kai-Chiang Wu, Hsinchu, TW;
Taiwwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.