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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12033963 B1

PDFFull Text
Date of Patent:
Jul. 09, 2024

Filed:

Aug. 30, 2021

Package structure comprising thermally conductive layer around the ic die

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chung-Hao Tsai, Changhua County, TW;

Tzu-Chun Tang, Kaohsiung, TW;

Chuei-Tang Wang, Taichung, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Didarul A Mazumder

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/291 (2013.01); H01L 24/19 (2013.01); H01L 24/25 (2013.01); H01L 24/29 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/19 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/255 (2013.01); H01L 2224/29024 (2013.01); H01L 2224/32146 (2013.01);
Abstract

A package structure and a manufacturing method thereof are provided. The package structure includes a carrier substrate, an integrated circuit (IC) die thermally coupled to the carrier substrate through a thermally conductive layer, an antenna pattern disposed over the carrier substrate and the IC die, a redistribution structure disposed between the antenna pattern and the IC die, and an underfill disposed below and thermally coupled to the carrier substrate. The antenna pattern is electrically coupled to the IC die.

Find Patent Forward Citations

Tsai, Chung-Hao. (2024). Package structure comprising thermally conductive layer around the ic die (U.S. Patent No. 12033963). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12033963

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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