Yen-Ping Wang

This inventor holds 68 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Grenergy Opto Inc., Alitek Technology Corp.. Active years: 2006-2026.

USPTO Granted Patents = 68 (Patent Applications = 8)

% Patents Active = 75.0

Average Co-Inventor Count = 4.3

ph-index = 7

Forward Citations = 266(Granted Patents)

Forward Citations (Not Self Cited) = 255(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsin-Chu, TW (2011)
Taipei, TW (2006 - 2017)
Changhua, TW (2017)
Hemei Township, TW (2016 - 2022)
Changhua County, TW (2015 - 2024)

Company Filing History:

59 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

Alitek Technology Corp.

patents

Years Active: 2006-2026

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Areas of Expertise:

Integrated Fan-Out Package

Semiconductor Device

Manufacturing Method

Hybrid Bonding Structures

Package Structure

Interconnection Structure

Surface Mounting

Joint Material

Chip Scale Package

Post Encapsulation

Semiconductor Components

Solder Joint

68 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12593699 - Package structure (2026-03-31),

2. 12132247 - Semiconductor package and manufacturing method thereof (2024-10-29),

3. 12062619 - Semiconductor packages and forming methods thereof (2024-08-13),

4. 12046480 - Manufacturing method of a semiconductor device (2024-07-23),

5. 11894330 - Methods of manufacturing a semiconductor device including a joint adjacent to a post (2024-02-06),

6. 11855011 - Package structure and method of forming the same (2023-12-26),

7. 11742219 - Integrated fan-out package and manufacturing method thereof (2023-08-29),

8. 11569562 - Semiconductor package and manufacturing method thereof (2023-01-31),

9. 11515173 - Semiconductor devices and methods of manufacturing (2022-11-29),

10. 11417616 - Package structure and manufacturing method thereof (2022-08-16),

11. 11348874 - Semiconductor packages and forming methods thereof (2022-05-31),

12. 11329022 - Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices (2022-05-10),

13. 11239096 - Integrated fan-out package and manufacturing method thereof (2022-02-01),

14. 11211339 - Semiconductor device (2021-12-28),

15. 11114357 - Methods and apparatus for package with interposers (2021-09-07),

Title: The Innovative Legacy of Yen-Ping Wang

Introduction:

Yen-Ping Wang, a visionary inventor hailing from Changhua County, Taiwan, has spearheaded groundbreaking advancements in the realm of technology. With a repertoire of 64 patents to his name, Wang's relentless pursuit of excellence continues to inspire the next generation of inventors.

Latest Patents:

Among Wang's latest patents is the method of manufacturing a semiconductor device, which involves creating flat contact interfaces to enhance efficiency. Additionally, his invention of a package structure with a stacked patch antenna structure demonstrates his commitment to innovation in semiconductor packaging.

Career Highlights:

Having worked at esteemed companies like Taiwan Semiconductor Manufacturing Company Limited and Grenergy Opto Inc., Wang has left an indelible mark on the industry. His innovative approach to semiconductor technology has revolutionized the field and propelled it into a new era of advancement.

Collaborations:

Throughout his illustrious career, Wang has collaborated with industry stalwarts such as Kai-Chiang Wu and Shih-Wei Liang. These partnerships have led to the development of cutting-edge technologies that have shaped the landscape of modern technology.

Conclusion:

Yen-Ping Wang's exceptional contributions to the field of technology have cemented his legacy as a visionary inventor. His innovative spirit and dedication to excellence serve as a beacon for aspiring inventors, driving them to push the boundaries of what is possible.