The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Aug. 20, 2020
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yen-Ping Wang, Changhua County, TW;
Chun-Lin Lu, Hsinchu, TW;
Han-Ping Pu, Taichung, TW;
Kai-Chiang Wu, Hsinchu, TW;
Chung-Yi Hsu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/31 (2013.01); H01L 23/66 (2013.01); H01Q 9/0407 (2013.01);
Abstract
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.