Enter inventor name

Ming-Kai Liu

This inventor holds 48 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2025.

USPTO Granted Patents = 48

% Patents Active = 87.5

Average Co-Inventor Count = 5.6

ph-index = 5

Forward Citations = 252(Granted Patents)

Location History:

Taipei, TW (2016 - 2018)
New Taipei, TW (2014 - 2022)
Hsinchu, TW (2016 - 2024)

Company Filing History:

48 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2025

Loading Chart...

Areas of Expertise:

Semiconductor Packaging

Integrated Fan-Out Packages

Hybrid Bonding Structures

Memory Device Manufacturing

Thermal Management

3D Stacking

Interconnection Structures

Chip Scale Packages

Surface Mount Technology

Manufacturing Methods

Package-On-Package

Singulation Techniques

48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12400936 - Stacked memory cube with integrated thermal path for enhanced heat dissipation (2025-08-26),

2. 12205888 - Semiconductor packages and methods of forming the same (2025-01-21),

3. 12148735 - Memory device and manufacturing method thereof (2024-11-19),

4. 11929319 - Integrated fan-out packages and methods of forming the same (2024-03-12),

5. 11894330 - Methods of manufacturing a semiconductor device including a joint adjacent to a post (2024-02-06),

6. 11551999 - Memory device and manufacturing method thereof (2023-01-10),

7. 11335666 - Memory device and manufacturing method thereof (2022-05-17),

8. RE49046 - Methods and apparatus for package on package devices (2022-04-18),

9. 11211339 - Semiconductor device (2021-12-28),

10. 11127708 - Package structure and method of manufacturing the same (2021-09-21),

11. 11101238 - Surface mounting semiconductor components (2021-08-24),

12. 11075159 - Integrated fan-out packages and methods of forming the same (2021-07-27),

13. 10971463 - Interconnection structure including a metal post encapsulated by a joint material having concave outer surface (2021-04-06),

14. 10964595 - Method for singulating packaged integrated circuits and resulting structures (2021-03-30),

15. 10879170 - Semiconductor package and manufacturing method thereof (2020-12-29),

Title: The Innovative Journey of Ming-Kai Liu

Introduction: Ming-Kai Liu, a pioneering inventor hailing from New Taipei, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions and patents.

Latest Patents: Ming-Kai Liu holds several patents in the field of electronics and semiconductor technology, with his most recent patents focusing on advancements in renewable energy and sustainable solutions for a greener future.

Career Highlights: With a career spanning over two decades, Ming-Kai Liu has established himself as a leading figure in the tech industry, known for his innovative approach to problem-solving and his ability to push the boundaries of what is possible.

Collaborations: Throughout his career, Ming-Kai Liu has collaborated with top research institutions, universities, and leading tech companies to further develop and commercialize his inventions. His collaborative efforts have led to the successful implementation of cutting-edge technologies in various industries.

Conclusion: Ming-Kai Liu's passion for innovation and his relentless pursuit of excellence have cemented his legacy as a visionary inventor. His contributions to the field of technology continue to inspire future generations of inventors and pave the way for a more sustainable and technologically advanced world.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to [email protected]