= 0.75 Inventors with similar research interests:
Location History:
- Hsin-Chi, TW (2017)
- Hsin-Chu, TW (2012 - 2024)
Company Filing History:
Years Active: 2012-2025
Title: Tin-Hao Kuo: Innovating the Future of Semiconductor Packaging
Introduction:
Tin-Hao Kuo, a renowned inventor and engineer based in Hsinchu, Taiwan, has consistently pushed the boundaries of semiconductor packaging technology. With a remarkable portfolio of 186 patents and a strong background in the field, his contributions have significantly impacted the industry. In this article, we will explore Kuo's latest patents, career highlights, and collaborations, showcasing his relentless pursuit of innovation.
Latest Patents:
Among Tin-Hao Kuo's most recent patents is his groundbreaking work on semiconductor package design and manufacturing methods. His patent titled "Semiconductor Package and Manufacturing Method Thereof" introduces a novel package structure that includes central and peripheral regions. Within this structure, functional dies and dummy dies are strategically placed, creating optimal vacancy ratios in both regions. This innovative design improves the performance and reliability of semiconductor packages while optimizing the space occupied by dies.
Another significant patent is his invention titled "Segregated Power and Ground Design for Yield Improvement." This patent outlines a method for encapsulating package components and forming redistribution layers with power/ground pad stacks. By incorporating power lines and electrical grounding lines in secondary redistribution layers, Kuo's design ensures efficient power distribution and enhanced grounding, leading to improved manufacturing yield.
Career Highlights:
Tin-Hao Kuo has had a distinguished career at Taiwan Semiconductor Manufacturing Company Limited (TSMC), one of the world's leading semiconductor foundries. TSMC, often referred to as TSMC, has been at the forefront of semiconductor manufacturing, pioneering advancements that have shaped the industry.
As a key member of TSMC, Kuo has played a vital role in driving innovation and research into semiconductor packaging technologies. His extensive patent portfolio attests to his deep understanding of the field and his ability to contribute groundbreaking solutions.
Collaborations:
In his pursuit of innovation, Tin-Hao Kuo has collaborated with esteemed professionals in the industry. Notable among his coworkers are Hao-Yi Tsai and Chen-Shien Chen, who have also made significant contributions to the semiconductor packaging landscape. Their collaborations demonstrate their shared commitment to pushing the boundaries of technology and driving the industry forward.
Conclusion:
Tin-Hao Kuo's outstanding achievements in semiconductor packaging and his impressive patent portfolio are testaments to his ingenuity and expertise. Through his work, he has introduced groundbreaking designs that improve the performance, reliability, and manufacturing yield of semiconductor packages.
As an industry-leading inventor and engineer, Kuo continues to push the boundaries of innovation at Taiwan Semiconductor Manufacturing Company Limited. His collaborations with other notable professionals further underline his commitment to advancing the field. With each patent, Kuo contributes to shaping the future of semiconductor packaging and solidifying his position as a trailblazer in the industry.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.