The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jul. 12, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yu-Chia Lai, Miaoli County, TW;
Chen-Hua Yu, Hsinchu City, TW;
Chung-Shi Liu, Hsinchu City, TW;
Hao-Yi Tsai, Hsinchu City, TW;
Kuo-Chung Yee, Taoyuan City, TW;
Tin-Hao Kuo, Hsinchu City, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H10W 40/00 (2026.01); H10W 40/60 (2026.01); H10W 70/60 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/611 (2026.01); H10W 40/037 (2026.01); H10W 70/611 (2026.01); H10W 70/685 (2026.01); H10W 74/014 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01);
Abstract
A package structure includes a first die, an encapsulant and a securing element. The encapsulant encapsulates the first die. The securing element penetrates through the encapsulant and a corner of the first die and electrically isolated from the first die.