The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Jan. 05, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Mao-Yen Chang, Kaohsiung, TW;
Yu-Chia Lai, Zhunan Township, TW;
Kuo-Lung Pan, Hsinchu, TW;
Hao-Yi Tsai, Hsinchu, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Hsiu-Jen Lin, Zhubei, TW;
Po-Yuan Teng, Hsinchu, TW;
Cheng-Chieh Wu, Hsinchu, TW;
Jen-Chun Liao, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.