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For the Inventor, By the Inventor

Hsinchu, Taiwan

Po-Yuan Teng

This inventor holds 37 USPTO granted patents and 16 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Tsing Hua University, Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Po-Yuan Teng. Retrieved from https://idiyas.com/inventor/po-yuan-teng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 37 

% Patents Active = 97.3

Average Co-Inventor Count = 6.3

ph-index = 2

Forward Citations = 20(Granted Patents)


Location History:

  • New Taipei, TW (2014)
  • Hsinchu, TW (2015 - 2024)

Company Filing History:

goldMedal33 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 1,308 
 
National Tsing Hua University
 patents
bronzeMedal1 out of 491 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Device
Integrated Circuit Package
Heat Dissipation Structure
RDL Stacks
Silicon Substrate Interposer
Chemical Vapor Deposition
Graphene Manufacturing
Circuit Board Structure
Packaging Method
Fabrication Method
Mark Formation
Layer Removal
37 patents (USPTO):Explore Patents
1. 12628677 - Packages with thick RDLs and thin RDLs stacked alternatingly (2026-05-12),
2. 12566302 - Package structure and method of forming the same (2026-03-03),
3. 12525501 - Semiconductor device (2026-01-13),
4. 12489064 - Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark (2025-12-02),
5. 12406961 - Integrated circuit package and method (2025-09-02),
6. 12374592 - Semiconductor device and manufacturing method thereof (2025-07-29),
7. 12300618 - Semiconductor device having a heat dissipation structure connected chip package (2025-05-13),
8. 12205923 - Semiconductor device, circuit board structure and manufacturing method thereof (2025-01-21),
9. 12166015 - Semiconductor package and manufacturing method of semiconductor package (2024-12-10),
10. 12057405 - Packages with thick RDLs and thin RDLs stacked alternatingly (2024-08-06),
11. 12051666 - Package structure and manufacturing method of package structure thereof (2024-07-30),
12. 12014976 - Chip package structure including a silicon substrate interposer and methods for forming the same (2024-06-18),
13. 12009281 - Package structure and method of manufacturing the same (2024-06-11),
14. 11990381 - Integrated circuit packages having support rings (2024-05-21),
15. 11848233 - Semiconductor package and manufacturing method thereof (2023-12-19),

Title: The Innovative Journey of Po-Yuan Teng

Introduction: Po-Yuan Teng is a visionary inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Po-Yuan Teng holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and forward-thinking approach to problem-solving.

Career Highlights: With a career spanning over two decades, Po-Yuan Teng has worked with leading tech companies and research institutions, spearheading projects that have revolutionized industries and paved the way for future advancements.

Collaborations: Throughout his career, Po-Yuan Teng has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge-sharing that has led to numerous successful projects and inventions.

Conclusion: Po-Yuan Teng's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the world of inventions. His work continues to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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