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For the Inventor, By the Inventor

Hsinchu, Taiwan

Kuo-Lung Pan

USPTO Granted Patents = 29 

Average Co-Inventor Count = 6.4

ph-index = 3

Forward Citations = 25(Granted Patents)


Company Filing History:

goldMedal29 out of 40,850 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2025

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29 patents (USPTO):Explore Patents
1. 12512451 - Semiconductor package and manufacturing method of the same (2025-12-30),
2. 12500219 - Trimming and sawing processes in the formation of wafer-form packages (2025-12-16),
3. 12451417 - Semiconductor package and manufacturing method thereof (2025-10-21),
4. 12406961 - Integrated circuit package and method (2025-09-02),
5. 12388060 - Integrated fan-out packages and methods of forming the same (2025-08-12),
6. 12374592 - Semiconductor device and manufacturing method thereof (2025-07-29),
7. 12322706 - Chip package and method of forming the same (2025-06-03),
8. 12300571 - Integrated circuit package and method (2025-05-13),
9. 12278208 - Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer (2025-04-14),
10. 12166015 - Semiconductor package and manufacturing method of semiconductor package (2024-12-10),
11. 12051666 - Package structure and manufacturing method of package structure thereof (2024-07-30),
12. 12009281 - Package structure and method of manufacturing the same (2024-06-11),
13. 11942451 - Semiconductor structure and method of forming the same (2024-03-26),
14. 11848300 - Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer (2023-12-19),
15. 11749582 - Package structure (2023-09-05),

Title: Innovations by Kuo-Lung Pan in Semiconductor Packaging

Introduction

Kuo-Lung Pan, based in Hsinchu, Taiwan, is an accomplished inventor with a remarkable portfolio consisting of 20 patents primarily focused on semiconductor packaging technologies. His innovative contributions have significantly advanced the field of electronics and semiconductor manufacturing.

Latest Patents

Among his latest patents, Pan has developed a novel semiconductor package and a manufacturing method for it. This package integrates a lower semiconductor device with a series of conductive pillars and an upper semiconductor device, all encapsulated within a protective material. The design features a redistribution structure that improves the overall functionality and connectivity of the semiconductor devices.

Another significant patent detailed by Pan includes a package structure that effectively encapsulates at least one semiconductor die. This package is enhanced by a redistribution structure that includes both signal lines and a pair of repair lines, offering improved electrical connectivity and facilitating repairs in the event of damage.

Career Highlights

Kuo-Lung Pan is associated with Taiwan Semiconductor Manufacturing Company Limited, where he applies his expertise in semiconductor packaging. His work consistently reflects his commitment to innovation and excellence in semiconductor technology. Over the years, he has contributed to various advancements that have paved the way for more efficient semiconductor manufacturing processes.

Collaborations

During his career, Pan has collaborated with distinguished colleagues, including Hao-Yi Tsai and Tin-Hao Kuo. These partnerships have fostered a collaborative environment that enhances the creativity and effectiveness of their innovative projects.

Conclusion

Kuo-Lung Pan's extensive contributions to semiconductor packaging and his impressive patent portfolio underscore his role as a leading inventor in the industry. His innovative work not only enhances the performance of electronic devices but also sets the stage for future advances in semiconductor technology.

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