The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Aug. 08, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Mao-Yen Chang, Kaohsiung, TW;
Chun-Cheng Lin, New Taipei, TW;
Chih-Wei Lin, Hsinchu County, TW;
Yi-Da Tsai, Chiayi Country, TW;
Hsaing-Pin Kuan, Hsinchu, TW;
Chih-Chiang Tsao, Taoyuan, TW;
Hsuan-Ting Kuo, Taichung, TW;
Hsiu-Jen Lin, Hsinchu County, TW;
Yu-Chia Lai, Hsinchu, TW;
Kuo-Lung Pan, Miaoli County, TW;
Hao-Yi Tsai, Hsinchu, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package and a manufacturing method thereof are described. The semiconductor package includes a package having dies encapsulated by an encapsulant, a redistribution circuit structure, first and second modules and affixing blocks. The redistribution circuit structure is disposed on the package. The first and second modules are disposed on and respectively electrically connected to the redistribution circuit structure by first and second connectors disposed there-between. The first and second modules are adjacent to each other and disposed side by side on the redistribution circuit structure. The affixing blocks are disposed on the redistribution circuit structure and between the first and second modules and the redistribution circuit structure. The affixing blocks include first footing portions located below the first module, second footing portions located below the second module, and exposed portions exposed from the first and second modules. The affixing blocks join the first and second modules to the redistribution circuit structure.