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For the Inventor, By the Inventor

Taichung, Taiwan

Hsuan-Ting Kuo

This inventor holds 38 USPTO granted patents and 40 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsuan-Ting Kuo. Retrieved from https://idiyas.com/inventor/hsuan-ting-kuo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38 

% Patents Active = 89.5

Average Co-Inventor Count = 6.5

ph-index = 5

Forward Citations = 120(Granted Patents)


Company Filing History:

goldMedal37 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2016-2026

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Areas of Expertise:
Semiconductor Devices
3D Package Structure
Interconnect Structures
Manufacturing Method
Fan-Out Packages
Reflow Method
Package on Package
Electronic Device
Epoxy Flux Residue
Interconnection Joints
Dual Flow Control
Gel Dispensation
38 patents (USPTO):Explore Patents
1. 12649194 - Reflow method and system (2026-06-09),
2. 12613386 - Gel dispensation apparatus including dual flow control channels and method of operating the same (2026-04-28),
3. 12543612 - Semiconductor devices and methods of forming the same (2026-02-03),
4. 12512451 - Semiconductor package and manufacturing method of the same (2025-12-30),
5. 12417927 - Semiconductor device and method of manufacture (2025-09-16),
6. 12176319 - Reflow method and system (2024-12-24),
7. 12107064 - Semiconductor package and manufacturing method thereof (2024-10-01),
8. 12009345 - 3D package structure and methods of forming same (2024-06-11),
9. 11996400 - Manufacturing method of package on package structure (2024-05-28),
10. 11874513 - Package structure (2024-01-16),
11. 11830746 - Semiconductor device and method of manufacture (2023-11-28),
12. 11664300 - Fan-out packages and methods of forming the same (2023-05-30),
13. 11610859 - Reflow method and system (2023-03-21),
14. 11585992 - Package structure (2023-02-21),
15. 11545465 - 3D package structure and methods of forming same (2023-01-03),

Title: The Innovative Journey of Hsuan-Ting Kuo

Introduction:

Hsuan-Ting Kuo, a talented inventor hailing from Taichung, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Kuo's latest patents include cutting-edge technologies in the realm of artificial intelligence and renewable energy, showcasing his commitment to creating a more sustainable future.

Career Highlights:

Throughout his illustrious career, Kuo has been recognized for his pioneering work in developing advanced robotics systems and smart home devices, revolutionizing the way we interact with technology on a daily basis.

Collaborations:

Kuo has collaborated with leading research institutions and tech companies worldwide, fostering a culture of innovation and knowledge-sharing that has propelled the industry forward.

Conclusion:

In conclusion, Hsuan-Ting Kuo's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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