The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Jan. 05, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Wei-Yu Chen, Taipei, TW;
Hao-Jan Pei, Hsinchu, TW;
Hsuan-Ting Kuo, Taichung, TW;
Chih-Chiang Tsao, Taoyuan, TW;
Jen-Jui Yu, Taipei, TW;
Philip Yu-Shuan Chung, Taipei, TW;
Chia-Lun Chang, Tainan, TW;
Hsiu-Jen Lin, Zhubei, TW;
Ching-Hua Hsieh, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.