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Taipei, Taiwan

Philip Yu-Shuan Chung

This inventor holds 17 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Philip Yu-Shuan Chung. Retrieved from https://idiyas.com/inventor/philip-yu-shuan-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 82.4

Average Co-Inventor Count = 8.8

ph-index = 2

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal17 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2020-2026

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Areas of Expertise:
Reflow Method
Laser Bonding
Semiconductor Device
Package on Package
Manufacturing Method
Semiconductor Package
Multi-Shot Laser
Semiconductor Structure
Device Manufacture
Semiconductor Technology
17 patents (USPTO):Explore Patents
1. 12649194 - Reflow method and system (2026-06-09),
2. 12581977 - Bonding through multi-shot laser reflow (2026-03-17),
3. 12417927 - Semiconductor device and method of manufacture (2025-09-16),
4. 12368149 - Methods of forming semiconductor packages (2025-07-22),
5. 12176319 - Reflow method and system (2024-12-24),
6. 12040309 - Bonding through multi-shot laser reflow (2024-07-16),
7. 11996400 - Manufacturing method of package on package structure (2024-05-28),
8. 11942464 - Semiconductor package and method (2024-03-26),
9. 11830746 - Semiconductor device and method of manufacture (2023-11-28),
10. 11646293 - Semiconductor structure and method (2023-05-09),
11. 11610859 - Reflow method and system (2023-03-21),
12. 11462507 - Bonding through multi-shot laser reflow (2022-10-04),
13. 11342321 - Manufacturing method of package on package structure (2022-05-24),
14. 11069671 - Semiconductor package and method (2021-07-20),
15. 10790261 - Bonding through multi-shot laser reflow (2020-09-29),

Title: The Innovative Journey of Philip Yu-Shuan Chung

Introduction: Philip Yu-Shuan Chung, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Philip Yu-Shuan Chung's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights: With a career spanning over two decades, Philip Yu-Shuan Chung has worked with leading tech companies in Taiwan and Silicon Valley. He has been instrumental in developing cutting-edge solutions in the fields of robotics, Internet of Things (IoT), and renewable energy.

Collaborations: Throughout his career, Philip Yu-Shuan Chung has collaborated with top researchers from renowned universities such as National Taiwan University and Stanford University. His partnerships with industry experts have led to the successful commercialization of several innovative products.

Conclusion: Philip Yu-Shuan Chung's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors. His impact on the tech industry is profound, and his legacy as a visionary inventor is sure to endure for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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