The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jul. 28, 2022
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Wei-Yu Chen, Taipei, TW;
Chia-Shen Cheng, Zhubei, TW;
Hao-Jan Pei, Hsinchu, TW;
Philip Yu-Shuan Chung, Taipei, TW;
Kuei-Wei Huang, Hsinchu, TW;
Yu-Peng Tsai, Hsinchu, TW;
Hsiu-Jen Lin, Zhubei, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.