Hao-Jan Pei

This inventor holds 42 USPTO granted patents and 27 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2016-2026.

USPTO Granted Patents = 42 (Patent Applications = 27)

% Patents Active = 85.7

Average Co-Inventor Count = 7.9

ph-index = 4

Forward Citations = 37(Granted Patents)

Company Filing History:

40 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 437

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2016-2026

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Areas of Expertise:

Integrated Fan-Out Packages

Laser Reflow

Warpage Control

Heat Dissipation Structure

Semiconductor Devices

Package Structure

Manufacturing Method

Wafer Handling

Multi-Shot Bonding

Chip Package Formation

Thermal Management

Wafer Chuck

42 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12713957 - BONDING SCHEME FOR SEMICONDUCTOR PACKAGING (2026-08-18),

2. 12672587 - Method for forming conductive bumps by performing a reflow process (2026-06-30),

3. 12649194 - Reflow method and system (2026-06-09),

4. 12581977 - Bonding through multi-shot laser reflow (2026-03-17),

5. 12564055 - Package structure and method of fabricating the same (2026-02-24),

6. 12564054 - Package structure (2026-02-24),

7. 12564008 - Method and treatment system for uniform processing of semiconductor devices (2026-02-24),

8. 12489030 - Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure (2025-12-02),

9. 12417927 - Semiconductor device and method of manufacture (2025-09-16),

10. 12388060 - Integrated fan-out packages and methods of forming the same (2025-08-12),

11. 12368149 - Methods of forming semiconductor packages (2025-07-22),

12. 12368053 - Method for laser drilling process for an integrated circuit package (2025-07-22),

13. 12266559 - Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece (2025-04-01),

14. 12261088 - Package structure and method of forming the same (2025-03-25),

15. 12230597 - Package structure with warpage-control element (2025-02-18),

Title: Inventor Hao-Jan Pei

Introduction: Hao-Jan Pei is a renowned inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hao-Jan Pei holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Hao-Jan Pei has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout his career, Hao-Jan Pei has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Hao-Jan Pei's passion for innovation, coupled with his technical acumen and collaborative spirit, continues to drive him towards creating impactful solutions that shape the future of technology.